Preparation and characterization of slurry for chemical mechanical planarization CMP

Contrary to ILD and STI CMP, metal films are hard to remove using abrasives because of their inertness. Thus, metal CMP slurries need suitable oxidizers to form an oxidation layer on the surface that can be easily removed by abrasives. [Pg.273]

To formulate these slurries that are suitable for each CMP process, it is very important to understand the role and characteristics of each component in slurries. In this section, we will discuss the role and characteristics of each component for CMP performances in detail. [Pg.274]

Structure. For this reason, alumina abrasives have been used as the composite structure rather than in pure form. [Pg.276]

Dispersants are widely used to improve dispersion stability. According to the DLVO (Derjaguin, Landau, Vervey, and Overbeek) theory, particles in aqueous media can be agglomerated when van der Waals attraction is greater than electrostatic repulsion (Verwey et al., 1999 Derjaguin and Landau, 1941). By adding suitable dispersants, steric hindrance and electrostatic stabilization between the abrasives are obtained, which prevent abrasives from agglomerating. [Pg.276]

Langmuir and Freundlich adsorption models can be used to describe the adsorption behavior of dispersants on an abrasive surface. The Langmuir adsorption isotherm model assumes that the particle surface is homogeneously covered by the monolayer dispersant. It is expressed as follows [Pg.276]

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