Polyimide-metal interface application

Polvimide-Metal Interfaces. Several technological applications including semiconductor packaging and metallization demand a reliable and durable adhesion properties of the metal films. In the development of multilayer devices consist of alternating layers of metal and polyimides several reliable techniques are needed to study both thin films and their interfaces. The usefulness of the nuclear scattering techniques to study the metallization and the associated interfacial elemental diffusion processes under the effects of various temperature and humidity treatments on the metal-polyimide systems, such as Al, Cu, N, and Au on Du Pont Kapton type H have already been reported (21., 22.). Only a couple of examples are presented here to illustrate the ERD application. 

For a number of years, polymers such as polyimide, have been subjected to widespread research, because of their increasing importance as dielectric materials for the fabrication of microelectronic devices (1). In particular, the adhesion of metal or polyimide films deposited on polyimide substrates and vice versa, is of considerable importance in most applications, and many studies ranging from adhesion testing to detailed spectroscopic analysis of interfaces have been reported previously (2,3.. 5.6). 

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