Plastic-encapsulated microelectronics

M. G. Pecht, L. Nyugen, and E. B. Hakim, Plastic Encapsulated Microelectronics Materials, Processes Quality, Reliability and Applications, John Wiley Sons, Inc., New York, 1995. 

Hefner, A., et ah, SiC Power Diodes Provide Breakthrough Performance for a Wide Range of Applications, IEEE Trans. Power Electronics, Vol. 16, 2001, pp. 273-280. McCluskey, P., et ah, Reliability of Commercial Plastic Encapsulated Microelectronics at Temperatures from 125°C to 300°C, 2000 IEEE Aerospace Conf. Proc., Vol. 5, March 18-25, 2000, pp. 445-450. 

When plastic-encapsulated microelectronic devices are exposed to aggressive environments, there is often a bimodal distribution in the time to fail resulting from... 

Taylor, C. H., Plastic encapsulated semiconductor devices— bibliography III, Microelectron. Reliab., 19 (1979) 403. 

Harrison, J. C., Control of the encapsulation material as an aid to long term reliability in plastic encapsulated semiconductor components. Microelectron. Reliab., 16 (1977) 233. 

The acoustic microscopy s primary application to date has been for failure analysis in the multibillion-dollar microelectronics industry. The technique is especially sensitive to variations in the elastic properties of semiconductor materials, such as air gaps. SAM enables nondestructive internal inspection of plastic integrated-circuit (IC) packages, and, more recently, it has provided a tool for characterizing packaging processes such as die attachment and encapsulation. Even as ICs continue to shrink, their die size becomes larger because of added functionality in fact, devices measuring as much as 1 cm across are now common. And as die sizes increase, cracks and delaminations become more likely at the various interfaces. 

To avoid surface corrosion processes, the microelectronic industry takes three precautions it avoids the use of solvents and reagents that may leave an ionic residue on the microcircuits it encapsulates the integrated circuits and it packages the microcircuits in plastic containers. When used in weapons, in space, or in undersea communi... 

The most signilieant application for conductive adhesives in the manufacture of microelectronics is the attachment of silicon chips to lead frames. Of the 40 billion integrated circuits (ICs) manufactured each year, approximately 90% are encapsulated in plastic-molded packages, and most of these are assembled with conductive adhesives [4]. A schematic illustration of a plastic-molded IC package is shown in Fig. 2. The conductive... 

Epoxy Molding Compounds as Encapsulation Materials for Microelectronic Devices Table 1. Component materials for plastic packages... 

Hirsch, H., Resin systems used for encapsulation of microelectronic packages. Proc. Soc. Plastics Engineers, 28th Annual Technical Conference, 380 (May 1970), New York. 

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