Photonics lithographic fabrication

JL olymers are increasingly being used in a wide variety of applications in electronics and photonics, most of which use polymers in their traditional role as engineering materials (e.g., circuit boards, molded products, wire and cable insulation, encapsulants, and adhesives). In addition, many other unique applications require material properties that only polymers can provide. Examples include resist materials for the lithographic fabrication of integrated circuits (1C) and polymers for optical recording. These types of applications may be considered passive in the sense that the polymer does not play an active role in the operation of the device or circuit. Rather, it serves some other function such as mechanical support, electrical insulation, or in the case of resists, some intermediate function in the fabrication of the device. 

In addition, it is very important to arrange, align, orientate, and integrate these polymer and/or hybridized NCs exactly and selectively on a substrate [55-59, 61, 87], and one should keep such kinds of NCs in mind in order to input and output optical- and electric-signals and/or information for device application. Here, encapsulation of polymer NCs and their arrangement by the use of a lithographically patterned substrate have been proposed to solve the above-mentioned problems [61]. As a typical example, the assembled structure of polymer microspheres (MSs) having mono-dispersed size is well known in the applications of some photonic crystal devices [87], In contrast, the proposed fabrication procedures seem to be much more extensive and superior to the previous ones. 

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