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Photoetchable glass

Dietrich, T. R., Ehrfeld, W., Lacher, M., Kramer, M., Speit, B., Fabrication technologies for microsystems utilizing photoetchable glass, Micoelectron. Eng. [Pg.570]

Fig. 8. Integrated microreaction system containing mixing units and heat exchangers a Integrated system in photoetchable glass made by photolithography and wet etching, b Detail of an integrated system in a special alloy made by micro spark erosion (EDM-grinding)... Fig. 8. Integrated microreaction system containing mixing units and heat exchangers a Integrated system in photoetchable glass made by photolithography and wet etching, b Detail of an integrated system in a special alloy made by micro spark erosion (EDM-grinding)...
Dietrich T.R., Ehrtfeld W., Lacher M., Kramer M., and Speit B., "Fabrication Technologies for Microsystems Utilizing Photoetchable Glass," Microelect. Eng., 30, 497-504 (1996). [Pg.341]

The microstructures are fabricated by photoetching of a specially glass (see Figure 1.79) [20, 124], Such microstructured plates are joined by soldering. The joint plate stack is held in a frame. [Pg.105]

The glass version of the SuperFocus mixer is composed of three layers containing similar structures to the standard triangular mixer [M 43] (see above) [20, 37, 39, 121]. Photoetching of a specially glass is used for manufacture. [Pg.115]

The glass plates were manufactured by photoetching of a specially glass and were irreversibly bonded by a thermal soldering process [39],... [Pg.154]

Physical properties Fused silica Borosilicate glass Photoetchable special glasses... [Pg.23]

The only system that employs the direct mode for semiconductor etching was reported by Lin et al. (3). n-GaAs was photoetched by holding a sharp metallic tip, insulated in glass, in close proximity (<1 /xm) to a positively biased (4 V) n-GaAs while illuminating the substrate. The formation of etched patterns with line widths of 0.3-2 /xm was attributed to the nonuniform spatial current distribution. Nonetheless, some etching also occurred across the whole surface because there was no attempt to focus the illumination on the area beneath the UME. [Pg.594]

S. Shoji, M. Esashi, in Photoetching and Electrochemical Discharge Drilling of Pyrex Glass, Technical Biggest of the 9th Sensor Symposium (1990), p. 27... [Pg.312]


See other pages where Photoetchable glass is mentioned: [Pg.321]    [Pg.321]    [Pg.111]    [Pg.321]    [Pg.321]    [Pg.111]    [Pg.206]    [Pg.146]    [Pg.235]    [Pg.22]    [Pg.206]    [Pg.541]    [Pg.757]    [Pg.56]    [Pg.270]   
See also in sourсe #XX -- [ Pg.22 ]




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