Phenolic adhesives moisture effects

Not only is low tensile shear strength noticed on moisture aging, but also the mode of failure changes from one of cohesion to adhesion. Table 7.6 shows the effect of humidity and water immersion on an epoxy-nylon adhesive compared to a nitrile-phenolic adhesive. Substrate primers have been used with epoxy-nylon adhesives to provide improved moisture... 

The moisture content of both the wood and the adhesive affect the fracture behavior of adhesive bonded joints. Wood joints are especially sensitive to moisture effects as a result of the porosity and permeability of wood, which allows ready access by water to both the interior of the wood member and the adhesive layer. Irle and Bolton [57] showed that the superior durability of wood-based panels bonded with an alkaline PF adhesive compared to panels bonded with a UF adhesive was due to the ability of the phenolic adhesive to absorb and be plasticized by water. In the plasticized state, the phenolic adhesive is able to reduce stress concentrations that otherwise fracture the wood or the adhesive in urea-bonded panels. 

The final addition of preservative shown in this formulation is essential in virtually all protein glues to provide mold resistance in high-humidity service. Without this protection, even heat-cured soybean adhesives will mold as the moisture content of the bonded wood approaches 20% [24]. Copper-8-quinolinolate, and copper naphthenate are among the few remaining preservatives permitted to be used in the United States at this time for wood products. Where the use of chlorinated phenols or orthophenyl phenol is still permitted, they are also very effective preservatives for protein glues at the addition level shown. In this case, the sodium hydroxide content of the glue formulation converts the water-insoluble chlorinated fungicides to their soluble sodium salts. 

Dynamic mechanical analysis provides a useful technique to study the cure kinetics and high temperature mechanical properties of phenolic resins. The volatile components of the resin do not affect the scan or limit the temperature range of the experiment. However, uncured samples must be supported by a braid, a scrim, or paper. This does not influence the kinetic results and can be corrected in the calculations of dynamic mechanical properties (qv). Recent DMA work on phenolic resins has been used to optimize the performance of structural adhesives for engineered wood products and determine the effect of moisture in wood product on cure behavior and bond strength (75-77). 

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