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Personal protective equipment conductive materials

Wafer cleaning uses strong acids and oxidizer mixtures, including piranha etch, to clean away any organic materials adhering to the wafer. Hydrofluoric acid is used to remove any oxide on the wafer. These processes are conducted in a wet-process hood to control vapor off-gassing and with substantial personal protective equipment to avoid contact with these corrosive and reactive materials. Acid exposure by vapor causes severe irritation of the upper respiratory tract. Eyes and mucous membranes exposed to acid vapors can be damaged and exposures to nitric acid can discolor the cornea and skin. [Pg.197]

See other pages where Personal protective equipment conductive materials is mentioned: [Pg.25]    [Pg.244]    [Pg.245]    [Pg.25]    [Pg.82]    [Pg.94]    [Pg.43]    [Pg.206]    [Pg.374]    [Pg.22]    [Pg.860]    [Pg.861]    [Pg.193]    [Pg.10]    [Pg.451]    [Pg.106]    [Pg.30]    [Pg.451]    [Pg.170]    [Pg.478]    [Pg.477]    [Pg.720]    [Pg.368]    [Pg.206]    [Pg.41]    [Pg.121]    [Pg.118]    [Pg.303]    [Pg.25]    [Pg.341]    [Pg.20]    [Pg.353]    [Pg.354]    [Pg.195]    [Pg.184]   
See also in sourсe #XX -- [ Pg.521 , Pg.522 ]



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Equipment, personal

Personal Protection Equipment

Personal protection

Personal protective

Personal protective equipment

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