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Paste adhesives underfills

A third approach to underfilling involves applying an insulative thermoplastic preform (film) prior to attaching the device. Under pressure and heat, the preform softens and flows around the solder bumps, then solidifies quickly on cooUng. The devices may then be solder reflowed to make the connections or the preform may be formulated to flow and encapsulate the solder during solder reflow. Table 5.6 lists some commercially available preforms used as underfills. Anisotropic film adhesives have also been used as underfill preforms, in which case z-direction conductive paths are formed beneath the solder bumps at the same time that the rest of the insulating film flows and cures around the bumps. Anisotropic paste adhesives can be similarly used (Figure 5.11). [Pg.238]

SMT adhesives, solder pastes, conductive epoxies, solder masks, and no-flow underfill materials SMT adhesives, solder pastes, conductive epoxies, solder masks, and no-flow underfill materials... [Pg.191]

Champion 3000/ Creative Automation 18 X 18 1.5 True Volume Pump / 90,000 (maximum) Underfill, encapsulation. Dam Fill, conductive epoxy, SMA and solder paste SMT Adhesives Loctite Chipbonder 3615 (red), Dymax 9-20365 (red) and 20366 (yellow). [Pg.234]

See other pages where Paste adhesives underfills is mentioned: [Pg.190]    [Pg.231]    [Pg.282]    [Pg.284]    [Pg.45]    [Pg.129]    [Pg.32]    [Pg.52]    [Pg.154]    [Pg.33]    [Pg.52]    [Pg.154]    [Pg.251]    [Pg.1014]    [Pg.241]   
See also in sourсe #XX -- [ Pg.239 ]



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