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Oxygen atmosphere and

During combustion, N0X is formed either by the reaction of oxygen and atmospheric nitrogen (thermal N0X) or the oxidation of chemically bound nitrogen in the fuel (fuel N0X). The production of thermal N0X can be minimized by various techniques which lower the flame temperature. The reduction of thermal N0X alone may not lower N0X emissions to within acceptable regulatory limits. Thus, it will be necessary to limit fuel N0X emissions. [Pg.301]

From the perspective of laboratory practice, the sensitivity of many indoles to acids, oxygen and light prescribes the use of an inert atmosphere for most reactions involving indoles and the avoidance of storage with exposure to light. This sensitivity is greatly attenuated by electron-withdrawing (EW) substituents. [Pg.3]

The effectiveness of phenoHc inhibitors is dependent on the presence of oxygen and the monomers must be stored under air rather than an inert atmosphere. Temperatures must be kept low to minimise formation of peroxides and other products. Moisture may cause mst-initiated polymerization. [Pg.157]

Metallui ical. To prevent reaction with atmospheric oxygen and nitrogen, some metals must be shielded using an inert gas when heated or melted (94). AppHcations in metals processing account for most argon consumption and an important part of helium usage (see AfETALLURGY). [Pg.14]

The majority of thermal polymerizations are carried out as a batch process, which requires a heat-up and a cool down stage. Typical conditions are 250—300°C for 0.5—4 h in an oxygen-free atmosphere (typically nitrogen) at approximately 1.4 MPa (200 psi). A continuous thermal polymerization has been reported which utilizes a tubular flow reactor having three temperature zones and recycle capabiHty (62). The advantages of this process are reduced residence time, increased production, and improved molecular weight control. Molecular weight may be controlled with temperature, residence time, feed composition, and polymerizate recycle. [Pg.355]

Fig. 4. Sihcon dioxide growth rate using a (100) sihcon substrate where the sohd lines represent a dry oxygen and the dashed lines a steam atmosphere. Fig. 4. Sihcon dioxide growth rate using a (100) sihcon substrate where the sohd lines represent a dry oxygen and the dashed lines a steam atmosphere.
Poljraer surfaces can be easily modified with microwave or radio-frequency-energized glow discharge techniques. The polymer surface cross-links or oxidizes, depending on the nature of the plasma atmosphere. Oxidizing (oxygen) and nonoxidizing (helium) plasmas can have a wide variety of effects on polymer surface wettability characteristics (92). [Pg.434]


See other pages where Oxygen atmosphere and is mentioned: [Pg.278]    [Pg.166]    [Pg.89]    [Pg.137]    [Pg.313]    [Pg.930]    [Pg.452]    [Pg.348]    [Pg.622]    [Pg.278]    [Pg.166]    [Pg.89]    [Pg.137]    [Pg.313]    [Pg.930]    [Pg.452]    [Pg.348]    [Pg.622]    [Pg.80]    [Pg.216]    [Pg.357]    [Pg.52]    [Pg.27]    [Pg.525]    [Pg.240]    [Pg.240]    [Pg.304]    [Pg.347]    [Pg.377]    [Pg.194]    [Pg.255]    [Pg.487]    [Pg.124]    [Pg.137]    [Pg.161]    [Pg.458]    [Pg.68]    [Pg.421]    [Pg.224]    [Pg.23]    [Pg.41]    [Pg.79]    [Pg.80]    [Pg.481]    [Pg.481]    [Pg.206]    [Pg.250]    [Pg.281]    [Pg.443]    [Pg.95]    [Pg.347]    [Pg.502]    [Pg.26]   
See also in sourсe #XX -- [ Pg.6 , Pg.7 , Pg.26 , Pg.132 , Pg.133 , Pg.134 , Pg.198 , Pg.201 ]




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