Oxydiphthalic dianhydride

Zang and coworkers [147] reported the characterization of three homochiral helical coordination polymers of Cu(II) with 2,2, 3,3 -oxydiphthalic dianhydride. TG and powder XRD analyses showed that one of the porous frameworks is stable after the removal of solvent water molecules. In contrast, the others changed their structures to amorphous ones because of the simultaneous loss of solvent and coordination water molecules. 

C22H9BrN205 polyimide based on 3,3, 4,4 -oxydiphthalic dianhydride and 5-bromide-1,3-pheny lene-diamine 213... 

Imide Single Tg II was made from 3,4 -oxydianiline and oxydiphthalic dianhydride Sauer and Hsiao (1993a)... 

Fan and co-workers [6] found that a liquid crystalline PI prepared by copolycondensation of 3,5-diamino-benzoic-4 -biphenyl ester, 4,4 -diamino-biphenyl ether and 3,3, 4,4 -oxydiphthalic dianhydride film had a 40% decrease in expansion coefficient accompanying a 270% improvement in tensile strength and a 300% improvement in modulus. These factors give a polymer with good film processibility. 

Table 7.4 Solubility of polyimide from oxydiphthalic dianhydride. 

There are only two inexpensive dianhydrides 3,3,4,4,-benzophcnonctctracarbox-ylic dianhydride (BTDA) and pyromellitic dianhydride (PMDA). Some other commercially available dianhydrides were used, like 3,3, 4,4 -biphenyltetracarboxylic dianhydride (BPDA), 2,2,-bis(3,4-dicarboxyphenyl) hexafluoropropane dianhydride (6FDA), oxydiphthalic anhydride (ODPA), and 3,3/,4,4/-diphenylsulfonetetracarboxylic dianhydride (DSDA) (Fig. 5.29). Many other dianhydrides are reported in the literature (Fig. 5.30) ... 

The aromatic diamines and dianhydrides used in the preparation of the polyamic acid resins and the diamic acid additives are listed in Figure 1. The 2,2-bis(3,4-dicarboxyphenyl)hexafluoropropane dianhydride (6FDA), 4,4 -oxydianiline (4,4 -ODA), and 3,3 -diaminodiphenylsulfone (3,3 -DDS02) were obtained from commercial sources. The remaining monomers were obtained as experimental materials as follows (1) 4,4 -bis(3,4-dicarboxyphenoxy) diphenylsulfide dianhydride (BDSDA) from General Electric Corporate R D Center (2) 4,4 -oxydiphthalic anhydride (ODPA) from Occidental Chemical Corporation (3) 2,2-bis[4(4-aminophenoxy)phenyl]hexafluoropropane (4-BDAF) from Ethyl Corporation and (4) 2,2-bis[4(3-aminophenoxy)phenyl]hexafluoropropane (3-BDAF) and 3,3 -oxydianiline (3,3 -ODA) from Mitsui Toatsu, Inc. 

A series of 15 wt % isomeric polyimide precursor resin solutions was prepared by the National Aeronautics and Space Administration Langley Research Center. The polymerization procedure has been described previously (2,3). The poly(amic-acid) resin solutions were made from 3,3, 4,4 -benzophenonetetracarboxylic acid dianhydride (BTDA), 4,4 -oxydiphthalic anhydride (ODPA), diaminobenzophenone (DABP), and methylenedianiline (MDA) monomers. 

The incorporation of pyridine or triazole improves the adhesion between poly(imide)s and copper.Poly(3,3, 4,4 -benzophenone tetracarboxylic dianhydride-3,5-diamino-l,2,4-triazole) (BTDA-DATA) contains the triazole moiety as repeating units. Poly(4,4 -oxydiphthalic anhydride-1,3-aminophenoxybenzene-8-azaadenine) (ODPA-APB-8-AA) bears the triazole moieties at the end." BTDA-DATA starts to decompose at 350°C. However, ODPA-APB-8-AA starts to decompose at 400°C. The polymers have been tested as adhesives for copper surfaces. The adhesion is increased by the formation of copper complexes. 

Intrinsically microporous Pis have been prepared from 2,2 -diamino-l,l -binaphthalene or 4,4 -(9-fluorenylidene)dianiline. As anhydrides pyromel-litic dianhydride, 3,3, 4,4 -biphenyltetracarboxylic dianhydride, 4,4 -oxydiphthalic anhydride, and 4,4 -(hexafluoroisopropylidene)diphthalic anhydride were used [81]. 

Figure 2 Relation between dissolution rate and PAA/PAE blend ratio. BTDA 3,3, 4,4-benzophenonetetracarboxylic dianhydride, DDE 4,4 -diamino-diphenyl ether, ODPA 4,4 -oxydiphthalic anhydride, DAPP 2,2-bis((3-amino-phenoxy)phenyl)propane.

All anhydride and amine compounds were of the highest quality commercially available. Aniline (AN) was distilled imder reduced pressure phthalic anhydride (PA) was sublimed and stored under anhydrous conditions. High-quality NMP (BASF) was stored over molecular sieves. All other reagents were used as received from commercial sources as follows 4-fluoroaniline (4-FA) (99%, Aldrich Chemical Co.), 3-fluorophthalic anhydride (3-FPA) (Fluorochem Ltd.), 2,2- bis(3,4-carboxyphenyl)hexafluoropropane dianhydride (6FDA) (monomer grade, Hoechst) 2,2-bis(4-aminophenyl)hexafluoropropane (6FDM) (99%, Chriskev Co., Inc.), l,l -bis(3,4-carboxyphenyl) sulfone dianhydride (SDA) (99%, Chriskev Co., Inc ), 1,1 -oxydiphthalic anhydride (ODPA) (Occidental Chemical Co.), (4-aminophenyl)phenyl ether and 4-aminophenylben-zophenone (Aldrich Chemical Co.). 

In a different smdy, they synthesized another five series of poly(ether imide)s based on five different cardo moiety containing diamines, designated as BPI, BAPA, FBP, BIDA, and SBPDA, as presented in Scheme 3.21. Five different aromatic dianhydride, 4,4 -(4,4 -isopropylidenediphenoxy) w(phthalic anhydride) (BPADA), 4,4 -(hexafluoro-isopropyli-dene) diphthalic anhydride (6-FDA), 3,3 4,4"-benzo-phenone tetracarboxylic acid dianhydride (BTDA), 4,4 -oxydiphthalic anhydride (ODPA), and benzene-1,2,4,5-tetracarboxylic dianhydride (PMDA), were used to prepare each series of poly(ether imide)s. The O2-N2 and CO2-CH4 separation properties for... 

Isomers of 3,3, 4,4 -oxydiphthalic anhydride(3,3, 4,4 -ODPA), i.e., 2,2, 3,3 -oxydiphthalic anhydride (2,2, 3,3 -ODPA) and 2,3,3, 4 -oxydiphthalic anhydride (2,3,3, 4 -ODPA) were synthesized. Polyimides were prepared from these dianhydrides, and their... 

Thesulphonatedpolyimidemembranesarebasedon4,4 -diaminobiphenyl-2,2 -disulphonic acid (BDSA), 4,4 -oxydianiline (ODA), 4,4 -oxydiphthalic anhydride (ODPA) and 1,4,5,8-naphthalenetetracarboxylic dianhydride (NTCDA). The study of the surface properties of fluorinated polyimides exposed to vacuum ultraviolet (VUV) radiation and atomic oxygen may help us understand the stability of these polymers. It will also be interesting to apply this sulphonation method to some novel high molar mass poly-etherimide, as reported by Hsio and Yang (1997). 

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