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Orientation, stress, or strain

Raman spectroscopy is a powerful tool for probing orientation, stress, and strain. Galiotis et al. have written a review on the determination of stress and strain in composites and fibers using Raman spectroscopy [179]. Young et al. discuss the complexities of correct interpretation of molecular orientation information encoded in Raman spectra of polymers [180]. Caution and a suitable number of control studies are necessary to prevent faulty conclusions. [Pg.221]

Wright of Advanced Micro Devices discusses the use of Raman microspectroscopy to measure the integrity of a film on semiconductor wafers during manufacture in US patent 6,509,201 and combined the results with other data for feed-forward process control [181]. Yield is improved by providing a tailored repair for each part. Hitachi has filed a Japanese patent application disclosing the use of Raman spectroscopy to determine the strain in silicon semiconductor substrates to aid manufacturing [182]. Raman spectroscopy has a well established place in the semiconductor industry for this and other applications [183]. [Pg.221]


See other pages where Orientation, stress, or strain is mentioned: [Pg.221]    [Pg.159]   


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