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Advanced Micro Devices

ATI YE BAYMAN—Advanced Micro Devices, M-S 111, Sunnyvale, CA 94086 RICHARD KROEKER—International Business Machines Corporation, San Jose, CA 95193... [Pg.418]

Wright of Advanced Micro Devices discusses the use of Raman microspectroscopy to measure the integrity of a film on semiconductor wafers during manufacture in US patent 6,509,201 and combined the results with other data for feed-forward process control [181]. Yield is improved by providing a tailored repair for each part. Hitachi has filed a Japanese patent application disclosing the use of Raman spectroscopy to determine the strain in silicon semiconductor substrates to aid manufacturing [182]. Raman spectroscopy has a well established place in the semiconductor industry for this and other applications [183]. [Pg.221]

Advanced Micro Devices Inc., Method of in situ monitoring of thickness and composition of deposited films using Raman spectroscopy. Inventor E. Adem. 23 Dec 2003. 5 pp. (inch 1 fig.). Appl. 4 Feb 2002. Int. Cl. C23C 16/52. US Patent Specification 6,667,070... [Pg.243]

Data Acquisition Telecommunications Local Area Networks. 1983 Data Book. Sunnyvale, CA Advanced Micro Devices, 1983. [Pg.237]

Wright of Advanced Micro Devices, Inc. discusses the use of Raman spectroscopy to measure the integrity of a film on semiconductor wafers during manufacture in US patent 6,50 9,201.87 The Raman measurements are made during the manufacturing process and can be considered an on-line system. Unlike many process Raman installations, this one is based on micro-Raman, where a microscope is used to focus the laser beam to a spot only a few micrometers in diameter. The Raman data is combined with other measurements, such as scatterometry, to calculate a stress level and compare it to... [Pg.159]

Adem of Advanced Micro Devices, Inc. was granted a patent on the use of Raman spectroscopy to monitor the thickness, crystal grain size, and crystal orientation of polysilicon or other films as they are deposited on semiconductor wafers via low-pressure chemical vapor deposition (CVD).89 The spectra are acquired with a non-contact probe through a suitably transparent window in the loading door. A feedback scheme is discussed. When the thickness has achieved the targeted value, the deposition is stopped. If the crystal grain size or orientation is deemed unsuitable, the deposition temperature is adjusted accordingly. [Pg.160]

Advanced Micro Devices (AMD)89 Akzo Nobel109 Ashland Oil56 Bayer Polymers40 BorgWarner Morse TECa... [Pg.162]

Wright, M.I. Method and Apparatus for Monitoring Wafer Stress US 6,509,201 Bl Assigned to Advanced Micro Devices, Inc. Piled in 2001. [Pg.168]

Adem, E. Method of In Situ Monitoring of Thickness and Composition of Deposited Films Using Raman Spectroscopy US 6,667,070 Assigned to Advanced Micro Devices, Inc. Filed in 2002. [Pg.168]

ADVANCED MICRO DEVICES 901 Thompson Place P. O. Box 453 Sunnyvale, CA 94086... [Pg.439]

Semiconductor A generic term for a device that controls electrical signals. It specifically refers to a material (such as silicon, germanium or gallium arsenide) that can be altered either to conduct electrical current or to block its passage. Carbon nanotubes may eventually be used as semiconductors. Semiconductors are partly responsible for the miniaturization of modem electronic devices, as they are vital components in computer memory and processor chips. The manufacture of semiconductors is carried out by small firms, and by industry giants such as Intel and Advanced Micro Devices. [Pg.26]

There are more than just Intel and Motorola processors out there. Among the so-called Intel clones were chips made by Advanced Micro Devices (AMD) and Cyrix. Table 2.5 shows some of the common processors made by AMD. Similarly, Table 2.6 shows some of the most popular Intel clone processors made by Cyrix. [Pg.81]

Conventional CPUs found in the majority of modern computers, such as those manufactured by Intel and advanced micro devices (AMD), are designed for sequential code execution as per the Von Neumann architecture [16]. While running a program, the CPU fetches instructions and associated data from the computer s random access memory (RAM), decodes it, executes it, and then writes the result back to the RAM. Within the realm of Flynn s taxonomy [17], this would be classified as single instruction, single data (SISD). [Pg.7]

Sponsors AlliedSignal Inc., Honeywell International, Advanced Micro Devices, Asahi Kasei Corporation, Pacific Fuel Cells Corp., Engelhard... [Pg.3244]

Materials Technology Development, Advanced Micro Devices,... [Pg.422]

Advanced Micro Devices, 429 Amoco Chemical Company, 67 AT T Bell Laboratories, 57,101,127,192,220 BP A (Technology and Management) Ltd., 470 Dexter Corporation, 375 Dow Chemical Company, 199,397,405 Dow Corning Corporation, 230,275 E. I. du Pont de Nemours and Company, 93 Eastman Kodak Company, 1 Emerson Cuming/W. R. Grace and Company, 268 Ford Motor Company, 249,321,337 Foster-Miller, Inc., 446 General Electric Company, 1,140,386... [Pg.477]

Figure 6.23 Extruded PFA tubes in a high purity fiuid handiing system. (Courtesy Advanced Micro Devices and DuPont Companies.)... Figure 6.23 Extruded PFA tubes in a high purity fiuid handiing system. (Courtesy Advanced Micro Devices and DuPont Companies.)...
Figure 1.1 Plot of the number of transistors versus year for microprocessors manufactured by Advanced Micro Devices, Inc. and Intel Corporation microprocessors. ... Figure 1.1 Plot of the number of transistors versus year for microprocessors manufactured by Advanced Micro Devices, Inc. and Intel Corporation microprocessors. ...
An extremely small MOSFET with a channel length of 15 nm was demonstrated by Yu and co-workers at Advanced Micro Devices, Inc. (AMD) in 2001. This device may serve as the basis for the most advanced IC chips containing well over one trillion devices. ... [Pg.150]

The fourth link between chemistry and lithography concerns the principles governing the chemical transformations utilized in process-integration schemes that are part of the implementation of lithography in IC device fabrication. This theme, discussed in Chapter 16, explores how lithography is used to define and pattern the various front end of lithography (FEOL) and back end of lithography (BEOL) layers of a state-of-the-art Advanced Micro Devices (AMD) microprocessor based on a complementary metal-oxide semiconductor (CMOS) device. [Pg.886]

Yang Zhao and Krishnendu Chakrabarty Advanced Micro Devices, Boston Design Center, Boxborough, MA, USA Department of Electrical and Computer Engmeeiing, Duke University, Durham, NC, USA... [Pg.1954]

W. Bacher, V. Sade, LIGA and AMANDA technologies forthe fabrication of advanced micro-devices, in Proceedings of the... [Pg.560]

Advanced micro devices (AMD) introduced a 4-b bit-sHced microprocessor, the Am2901. Bit-sliced processors were modular in that they could be assembled to form larger word sizes. The Am2901 had a 4-b ALU 16, 4-b registers and the hardware to connect carry/borrow signals between adjacent modules. In 1979, AMD developed the first floating point coprocessor for microprocessors. The AMD 9511 arithmetic circuit was used in some CP/M, Z-80-based systems and some systems based on the S-100 bus. [Pg.780]

We would like to gratefully acknowledge the technical contributions of the following individuals. Their assistance with this project is greatly appreciated Jim Campbell, Intel Stan Futagaki, Advanced Micro Devices Pat Murphy, Intel Jamie Rubin, Hewlett-Packard. [Pg.262]


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See also in sourсe #XX -- [ Pg.15 ]

See also in sourсe #XX -- [ Pg.116 ]




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