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Nickel deposition mechanism

Table 13.15 Typical mechanical properties of nickel deposits and wrought nickel... Table 13.15 Typical mechanical properties of nickel deposits and wrought nickel...
Rodriguez-Torres etal. [235] have used ammonia-containing baths for Zn-Ni alloy electrodeposition on Pt. Zinc and nickel species exist in the form of [Zn(NH3)4] + and [Ni(NH3)6] " complexes in such solutions. The deposition at pH 10 was investigated and compared with deposition from ammonium chloride baths at pH 5. The Ni content in the alloys was found to be 40-60% higher from the ammonia-containing bath than from the acidic baths. The deposition mechanism was found to be affected by complexation of the metal cations by ammonia. [Pg.745]

An in depth study of the deposition mechanism was carried out by Sun et al. who studied the 1 1 [EMIMJCl/ZnCf system at various temperatures on glassy carbon (GC), nickel and platinum electrodes [106], The GC electrode required the largest overpotential for deposition. The stripping process showed a single peak on GC, whereas on Ni two oxidation processes were observed, separated by ca. 0.6V. Itwas proposed that the more positive oxidation process corresponded to the dissolution of an intermetallic compound formed during electrodeposition. [Pg.105]

Features of the nickel electrochemical deposition into mesoporous silicon are discussed. The process was controlled by the surface potential of a sample relative to the reference Ag/Cl electrode. Complete pore filling with metal is reported. Cross-sectional SEM studies of the samples at various deposition stages allowed the deposition mechanism to be revealed. [Pg.406]

Caffio M, Atrei A, Bardi U, Rovida G (2005) Growth mechanism and structure of nickel deposited on Ag(001). Surf Sci 588 135... [Pg.72]

In atomization, a stream of molten metal is stmck with air or water jets. The particles formed are collected, sieved, and aimealed. This is the most common commercial method in use for all powders. Reduction of iron oxides or other compounds in soHd or gaseous media gives sponge iron or hydrogen-reduced mill scale. Decomposition of Hquid or gaseous metal carbonyls (qv) (iron or nickel) yields a fine powder (see Nickel and nickel alloys). Electrolytic deposition from molten salts or solutions either gives powder direcdy, or an adherent mass that has to be mechanically comminuted. [Pg.182]

Despite the large differences in respect of other mechanical properties, it has been established that the wear resistance of copper deposits, which is markedly inferior to, for example, that of electrodeposited nickel, is not significantly affected by either type of bath or addition agents. [Pg.521]

Deposits from Watts-type solutions Most coatings of nickel for engineering applications are electro deposited from a Watts-type bath Typical mechanical properties of deposits from Watts and sulphamate solutions are compared with those of wrought nickel in Table 13.15. [Pg.530]

The mechanical properties of Watts deposits from normal, purified solutions depend upon the solution formulation, pH, current density and solution temperature. These parameters are deliberately varied in industrial practice in order to select at will particular values of deposit hardness, strength, ductility and internal stress. Solution pH has little effect on deposit properties over the range pH 1 0-5-0, but with further increase to pH 5 -5, hardness, strength and internal stress increase sharply and ductility falls. With the pH held at 3-0, the production of soft, ductile deposits with minimum internal stress is favoured by solution temperatures of 50-60°C and a current density of 3-8 A/dm in a solution with 25% of the nickel ions provided by nickel chloride. Such deposits have a coarse-grained structure, whereas the harder and stronger deposits produced under other conditions have a finer grain size. A comprehensive study of the relationships between plating variables and deposit properties was made by the American Electroplaters Society and the results for Watts and other solutions reported... [Pg.531]


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See also in sourсe #XX -- [ Pg.612 ]




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