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Modulus Moisture

Modulus, 247 set also Retention modulus Moisture content of eluents, 80, 83 control of, 80-82 determination of, 80 Moisture control, 106 Moisture control system, for eluent, 81-83 Molar surface area, 171, ... [Pg.169]

Improved Hot—Wet Properties. Acryhc fibers tend to lose modulus under hot—wet conditions. Knits and woven fabrics tend to lose their bulk and shape in dyeing and, to a more limited extent, in washing and drying cycles as well as in high humidity weather. Moisture lowers the glass-transition temperature T of acrylonitrile copolymers and, therefore, crimp is lost when the yam is exposed to conditions requited for dyeing and laundering. [Pg.282]

Polymer Standard tenacity, GPa Breaking elongation, % Modulus, GPa Density, kg/m Moisture. c regain... [Pg.312]

The critical property for conformal coatings is resistance to chemicals, moisture, and abrasion. Other properties, such as the coefficient of thermal expansion, thermal conductivity, flexibiHty, and modulus of elasticity, are significant only in particular appHcations. The dielectric constant and loss tangent of the conformal coating are important for high speed appHcations. [Pg.532]

The effect of temperature on properties can be seen in Figure 2, which shows the effect on modulus of increasing temperature of unmodified and glass-reinforced nylon-6,6. Impact strength, however, shows a steady increase with temperature as it does with moisture. [Pg.269]

Fig. 2. Relatioaship betweea various strength properties of clear wood and moisture content. A, modulus of mpture B, compression paradel to grain C,... Fig. 2. Relatioaship betweea various strength properties of clear wood and moisture content. A, modulus of mpture B, compression paradel to grain C,...
Fig. 3. Effect of moisture content on bending strength of stmctural lumber, MOR = modulus of mpture. Fig. 3. Effect of moisture content on bending strength of stmctural lumber, MOR = modulus of mpture.
Fig. 5. The immediate effect of temperature on strength properties of clear wood, expressed as percentage of value at 20°C. Trends illustrated are composites from studies on three strength properties modulus of mpture in bending, tensile strength perpendicular to grain, and compressive strength parallel to grain. VariabiUty in reported results is illustrated by the width of the bands. MC = moisture content. Fig. 5. The immediate effect of temperature on strength properties of clear wood, expressed as percentage of value at 20°C. Trends illustrated are composites from studies on three strength properties modulus of mpture in bending, tensile strength perpendicular to grain, and compressive strength parallel to grain. VariabiUty in reported results is illustrated by the width of the bands. MC = moisture content.
Higher temperatures result in permanent degradation. The amount of this irreversible loss in mechanical properties depends upon moisture content, heating medium, temperature, exposure period, and, to some extent, species. The effects of these factors on modulus of mpture, modulus of elasticity, and work to maximum load are illustrated in Figures 6—9 (6). The effects may be less severe for commercial lumber than for clear wood heated in air (Fig. 10). The permanent property losses shown are based on tests conducted after specimens were cooled to - 24° C and conditioned to a moisture content of... [Pg.325]

The highly polar nature of the TGMDA—DDS system results in high moisture absorption. The plasticization of epoxy matrices by absorbed water and its effect on composite properties have been well documented. As can be seen from Table 4, the TGMDA system can absorb as much as 6.5% (by weight) water (4). This absorbed water results in a dramatic drop in both the glass transition temperature and hot—wet flexural modulus (4—6). [Pg.21]

These cures, characterized by their abiHty to proceed at low temperatures, are accelerated by moisture and develop high modulus. [Pg.493]

Automated soldering operations can subject the mol ding to considerable heating, and adequate heat deflection characteristics ate an important property of the plastics that ate used. Flame retardants (qv) also ate often incorporated as additives. When service is to be in a humid environment, it is important that plastics having low moisture absorbance be used. Mol ding precision and dimensional stabiUty, which requites low linear coefficients of thermal expansion and high modulus values, ate key parameters in high density fine-pitch interconnect devices. [Pg.32]

The explanation is almost the same as that for the transverse modulus the cell walls bend like beams, and collapse occurs when these beams reach their plastic collapse load. As with the moduli, moisture and temperature influence the crushing... [Pg.284]

Figure 18.11 shows the influence of temperature on the tension modulus of nylons 66 and 6 and Figure 18.12 the effect of temperature on impact strength of nylon 66. Figure 18.13 shows the profound plasticising influence of moisture on the modulus of nylons 6 and 66, while Figure 18.14 illustrates the influence of moisture content on impact strength. [Pg.492]

Figure 18.13. Effect of moisture content on the Young s modulus of nylon 66 and nylon 6... Figure 18.13. Effect of moisture content on the Young s modulus of nylon 66 and nylon 6...
Most moisture-curing liquid adhesives utilize poly(oxypropylene) (PPG) polyols, as shown above. These raw materials produce among the lowest-viscosity prepolymers but may not have sufficient modulus at higher temperatures for some applications. A certain percentage of polyester polyols may also be utilized to boost performance, but these may cause a large increase in viscosity, and so they are more often used in conjunction with polyether polyols to provide a high-performance adhesive with workable viscosities. Poly(butadiene) polyols may be utilized for specific adhesion characteristics. [Pg.782]

Microindentation anisotropy 143, 145 Microspherulitic structure 139 Microvoiding 193 Microvoids 194, 205 Model membranes 49, 53, 55 Modulus 135 Moisture sensitivity 199... [Pg.221]

The hardness of wood varies markedly from soft balsa to hard ironwood with pine, oak, and maple in between. It is measured either by determining the force needed to push a hard ball (diameter = 0.444 in) into the wood to a depth equal to half the ball s diameter (Janka hardness) or by the initial slope of the force vs. penetration-depth curve (Hardness modulus). Average values of Janka hardnesses for typical woods are listed in Table 13.1. The data are from Green et al., (2006), and are for penetration transverse to the tree axis. The values are for moisture contents of about ten percent. The first set of five items are hardwoods, while the second set are softwoods. To roughly convert Janka hardnesses to VHN multiply by 0.0045. [Pg.167]

Bank and co-workers [19] have proposed using thermal analysis to measure other parameters for detecting local moisture content, changes in modulus and damping, and crystallinity in composite materials. [Pg.88]

The dynamic viscoelastic properties of acetylated wood have been determined and compared with other wood treatments in a number of studies. Both the specific dynamic Young s modulus (E /j) and tan S are lower in acetylated wood compared with unmodified wood (Akitsu etal., 1991, 1992, 1993a,b Korai and Suzuki, 1995 Chang etal., 2000). Acetylation also reduces mechanosorptive creep deformation of the modified wood (Norimoto etal., 1992 Yano etal, 1993). In a study of the dynamic mechanical properties of acetylated wood under conditions of varying humidity, it was concluded that the rate of diffusion of moisture into the wood samples was not affected by acetylation (Ebrahimzadeh, 1998). [Pg.60]

The production of moisture resistant particleboard by treatment with a maleic anhydride -glycerol mixture and using phenol formaldehyde as the matrix material has been investigated (Fujimoto etal., 1987). Boards prepared from modified wood showed considerable improvements in modulus of elasticity and internal bond strength when compared to control boards. Composites made from aspen fibres modified with SA, MA or acetic anhydride using phenol-formaldehyde (PF) or polypropylene as binder have also been studied (Clemons etal., 1992 Rowell etal., 1993b). The reaction of wood with MA was found to proceed at a slower rate than with SA. The volume increase due to modification... [Pg.81]


See other pages where Modulus Moisture is mentioned: [Pg.413]    [Pg.413]    [Pg.347]    [Pg.282]    [Pg.341]    [Pg.331]    [Pg.67]    [Pg.220]    [Pg.248]    [Pg.269]    [Pg.463]    [Pg.23]    [Pg.188]    [Pg.500]    [Pg.493]    [Pg.30]    [Pg.409]    [Pg.537]    [Pg.358]    [Pg.385]    [Pg.41]    [Pg.189]    [Pg.601]    [Pg.406]    [Pg.35]    [Pg.294]    [Pg.496]    [Pg.7]    [Pg.31]    [Pg.42]    [Pg.114]   
See also in sourсe #XX -- [ Pg.111 , Pg.609 ]




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