MIP sensor arrays

MIP sensor elements are also suitable for the analysis of multicomponent samples. The cost-effective, miniaturised, non-covalent MIP sensor arrays, when combined with computational data evaluation, make weak artificial recognition phenomena highly applicable for smart sensors. In comparison to gas or liquid chromatography, the results with mass-sensitive MIP sensors are faster and cheaper to obtain [32]. For effective on-line monitoring, the ideal MIP sensor or actuator should allow reversible analyte enrichment without dependencies on intermediate washing procedures (with organic solvents, for example). 

MULTICOMPONENT ANALYSIS OF XYLENE MIXTURES IN THE PRESENCE OF HUMIDITY OF A NON-COVALENT MIP SENSOR ARRAY WITH IMPRINTED PST AND PMA (C/. FIG. 

An example of a non-covalent MIP sensor array is shown in Fig. 21.14. Xylene imprinted poly(styrenes) (PSt) and poly(methacrylates) (PMA) with 70 and 85% cross-linker have been used for the detection of o- and p-xylene. The detection has been performed in the presence of 20-60% relative humidity to simulate environmental conditions. In contrast to the calixarene/urethane layers mentioned before, p-xylene imprinted PSts still show a better sensitivity to o-xylene. The inversion of the xylene sensitivities can be gathered with PMAs and higher cross-linker ratios. As a consequence of the humidity, multivariate calibration of the array with partial least squares (PLS) and artificial neural networks (ANN) is performed, The evaluated xylene detection limits are in the lower ppm range (Table 21.2), whereas neural networks with back-propagation training and sigmoid transfer functions provide the most accurate data for o- and p-xylene concentrations as compared to PLS analyses. 

Variations of semiconductor PL and EL intensities resulting from analyte adsorption are promising techniques for chemical sensing. When coupled with films such as MIPS, the selectivity of such structures may be improved. Integrated devices in which forward- and reverse-biased diodes are juxtaposed using microelectronics fabrication methods provide an opportunity to create completely integrated sensor structures on a single chip and to prepare arrays of such structures. 

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