Microelectromechanics processes

Jiang, L., Anderson, S., Thong, E. Fabrication of Hall device structures in 3C-SiC using microelectromechanical processing technology, Microelectron. Eng., 83(4-9), 1396-1399 (2006). 

As physical structures used in technological applications have been reduced in size, there has been an increasing need to understand the limiting processes of adhesion and to try to minimize them. For example, adhesion due to humidity is known to have a major effect on the durabihty and friction forces experienced at the recording head/disk interface. Microelectromechanical systems (MEMS) are also detrimentally affected by nanoscale adhesion, with their motion being perturbed or prevented. 

M. von Arx, O. Paul, and H. Baltes. Process-dependent thin-film thermal conductivities of thermal CMOS MEMS , Journal of Microelectromechanical Systems 9, (2000), 136-145. 

D. Gibson, H. Carter, and C. Pm-dy. The Use of Hardware Description Languages in the Development of Microelectromechanical Systems , Analog Integrated Circuits and Signal Processing 28 (2001), 173-180. 

Our communications infrastructure relies heavily on advanced materials chemistries. From the manufacturing processes used to fabricate optical fiber cables to molecular beam epitaxy techniques for the creation of nanoscale heterostructures that enable many optical devices, innovations in materials chemistry have played a role. An example of a recent technological achievement that relates to optical communications systems is the MEMS-based (microelectromechanical system) Lambda Router. The Lambda Router is an optical system developed at Lucent Technologies for switching narrowly focused... 

MEMS (microelectromechanical systems) are systems with small device sizes of 1-100 pm. They are typically driven by electrical signals. To fabricate such systems materials like semiconductors, metals, and polymers are commonly used. MEMS technology fabrication is very cost-efficient. The structures are transferred by processes, which are applied to many systems on one substrate or even many of them simultaneously. The most important fabrication processes are physical vapor deposition (PVD), chemical vapor deposition (CVD), lithography, wet chemical etching, and dry etching. Typical examples for MEMS are pressure, acceleration, and gyro sensors [28,29], DLPs [30], ink jets [31], compasses [32], and also (bio)medical devices. 

Gianchandi YB, Ma KJ, Najafi K. A CMOS dissolved wafer process for integrated P + + microelectromechanical systems. In Proceesings of The 8th International Conference on Solid State Sensors and Actuators 1995. p 79-82. 

The fabrication of microelectromechanical systems (MEMS), e.g. actuators and sensors, is also one of the promising applications for nickel films. Nickel is currently electroplated into preform molds. One typical process is the LIGA process, where pure or alloyed nickel films are... 

Shaw KA, Zhang ZL, MacDonald NC (1994) SCREAM 1 a single mask, single-crystal sihcon, reactive ion etching process for microelectromechanical structures. Sens Actuators 40 63-70... 

K. R. Williams, K. R. Williams, K. Gupta, and M. Wasihk. Etch rates for micromachining processing-Part II Etch rates for micromachining processing-Part II. Microelectromechanical Systems, Journal of, 12(6) 761-778, 2003. 

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