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Metal Shorts

While connecting a delta-wound motor through a Y A starter, the metallic shorting links should be removed. Otherwise the starter will have a dead short-circuit at the motor terminal box and may burn the starter, damage the motor terminal box and even line cables. [Pg.239]

For the pyrimidines a range of the binding modes offers the possibility for metal-metal interactions (Fig. 24). Many of these combinations have been confirmed by X-ray crystallography, and a discussion of metal metal interactions has been presented (79). The extent of interaction appears to be dependent on both the electronic configuration and the geometry of the metal. Short intermetallic separations (Pt-Pd = 2.49 A) are observed for f raws-Pt(amine)2 derivatives, particularly those in which the filled Pt dz2 orbital can donate electron density into the heterometal dx2 v2 orbital (Fig. 25) (80). [Pg.111]

The observed much lower activation energies for the 1,5-H shifts in the complexes 37g-39r than in the free hydrocarbons (61-63) provide good evidence for an activation of the C—H bonds by the central metal. Short-lived [Cr(H)(CO)2 nL(>y5-dienyl)] complexes have to be considered as intermediates during the 1,5-H shift processes. [Pg.323]

Yield on metal short test structures with and without CMP planarization. (From Ref, (23).)... [Pg.174]

As with oxide CMP (Chapter 5), metal CMP may enhance yields by virtue of reduced defect densities. In addition to a reduction in nonplanarity induced defects (Section 5.24), CMP is a cleaner process than the relatively dirty RIE etch back processes. Figure 6.5 shows a 3X reduction in particles using CMP vs. RIE. The result is a decrease in metal-to-metal shorts on the subsequent interconnection level (Figure 6.6). As with oxide CMP, increased die yields is one of the major driving forces for acceptance of metal CMP processes for tungsten stud formation. ... [Pg.186]

Figure 6.6 Comparison of metal shorts for aluminum layer patterned after... Figure 6.6 Comparison of metal shorts for aluminum layer patterned after...
R. Bruning, P. Scholz, L. Morgenthal, O. Andersen, J. Scholz, G. Nocke, B. Ondruschka, Innovative catalysts for oxidative dehydrogenation in the gas phase - Metallic short fibers and coated glass fabrics, Chem. Eng. Technol. 28 (2005) 1056. [Pg.120]

A number of metals will dissolve gold, when the metals are at their melting point, for example metallic mercury (Hg) will dissolve a small amount of gold at room temperature. In about 1120 or 1150 CE, Artephius wrote of a process for dissolving gold in a particular metal. Shortly, we will look further into his method. [Pg.207]

In addition, many times single port technique is used to assess the EM radiation absorption capability of the material. In such measurement, a metal short is used to terminate the waveguide end. The incident signal is directed toward the metal-shorted end (Figure 9.5) and the reflected signal... [Pg.468]

For a two-side metalized, short-cireuited sample, the current response is given by the integral equation (1), containing a generalized distribution function G x) and the particular temperature profile T x, t) L is the sample thickness ... [Pg.614]

Figure 4.19 Illustration of a possible mechanism for top-metal penetration upon evaporation of the top metal contact onto the SAM. The SAM exhibits pinhole defects that can occur at grain boundaries where the natural tilt of the molecules (-20° off the surface normal) are dislocated at differing domains and at step edges where there are single atomic step defects in the underlying metal substrate. These pinhole defects could be the source of the metal shorts upon evaporation or continued usage of the devices. The larger the area, the more defects that will be present, thereby exacerbating the top metal punch through problem. Figure 4.19 Illustration of a possible mechanism for top-metal penetration upon evaporation of the top metal contact onto the SAM. The SAM exhibits pinhole defects that can occur at grain boundaries where the natural tilt of the molecules (-20° off the surface normal) are dislocated at differing domains and at step edges where there are single atomic step defects in the underlying metal substrate. These pinhole defects could be the source of the metal shorts upon evaporation or continued usage of the devices. The larger the area, the more defects that will be present, thereby exacerbating the top metal punch through problem.
RMI metal High (melting point of the metal) short Pressureless, one cycle Up to 98% dense, polycrystalline. [Pg.326]


See other pages where Metal Shorts is mentioned: [Pg.148]    [Pg.306]    [Pg.1014]    [Pg.13]    [Pg.45]    [Pg.282]    [Pg.456]    [Pg.5]    [Pg.64]    [Pg.340]    [Pg.163]    [Pg.663]    [Pg.326]    [Pg.213]    [Pg.46]    [Pg.2320]    [Pg.188]    [Pg.1047]    [Pg.468]    [Pg.10]    [Pg.210]    [Pg.274]    [Pg.1630]   
See also in sourсe #XX -- [ Pg.186 , Pg.187 ]




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