Metal-insulator-double semiconductor applications

Substrates The substrates in microelectronics are mainly Si wafers. For mobile applications, silicon-on-insulator (SOI) wafers increasingly replace bulk Si wafers and for very specific high-frequency applications, III-V compound semiconductors (e.g., GaAs) are used. The majority of substrates in microfabrication are Si wafers, but metal, glass, and ceramic substrates are also common. Particularly when using glass, quartz, and ceramic wafers in CMP processes, it has to be taken into account that they are brittle and easy to break. The situation is worse when the material is also under stress induced by deposited layers. For applications where the backside of the wafer has to be structured (e.g., in bulk micromachining), double-side polished substrates are employed. 

The progress in the discovery and use of new polymer electrodes is briefly discussed. Some of the possible applications of these new electrodes are suggested. As important background information for studying organic polymer electrochemistry, knowledge of the conduction mechanism is needed. The theory of bipolaron formation, as proposed by Bredas, et al., is presented. It is important to study the electrode-solution interface. Double layer models for metal, semiconductor, and insulator electrodes are probed. Recent work and applications of these electrodes are then briefly reviewed. This includes initiatives in the fields of electrode generated reactions, photoelectrochemistry, batteries, and molecular electronics. Finally, the needed areas of research, from an electrochemical point of view, are presented. 

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