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Matrix through-bond

The type denoted as Tabular alumina—comndum matrix is made from coarse supercalcined alumina aggregates and reactive calcined alumina fines to produce a direct bonded microstructure where alumina-to-alumina bonding (corundum-to-comndum) predominates. This provides an obvious increase in hot modulus of rupture (Table 12). The microstmcture of this type of brick is shown in Figure 10. In the lower field, a tabular alumina aggregate particle resides, and it is connected to the matrix through bonds with smaller corundum crystals. [Pg.101]

Failure of the composite material can then occur in two ways. First, the matrix shear stress around the fiber could exceed the allowable matrix shear stress. More precisely, the bond between the fiber and the matrix might be broken due to high shear stress in the aforementioned mechanism for transfer of stress between broken fibers. Second, the fiber fracture could actually propagate across the matrix through other fibers and hence cause overall fracture of the composite material. If a... [Pg.168]

The mechanical properties of composites reinforced with wood fibers and PVC or PS as resin can be improved by an isocyanate treatment of those cellulose fibers [41,50] or the polymer matrix [50]. Polymethylene-polyphenyl-isocianate (PMPPIC) in pure state or solution in plasticizer can be used. PMPPIC is chemically linked to the cellulose matrix through strong covalent bonds (Fig. 8). [Pg.797]

The fact that adenosine and its derivatives are azo coupling components is used for immobilizing nicotinamide-adenine nucleotide (NAD+) for affinity chromatography purposes. In 12.58 NAD+ is bonded to a matrix through an azo bond. Compound 12.58 is used for the purification of dehydrogenase enzymes (Hocking and Harris, 1973). [Pg.328]

Finally, metal- and resin-bonded composites are also classified as particulate composites. Metal-bonded composites included structural parts, electrical contact materials, metal-cutting tools, and magnet materials and are formed by incorporating metallic or ceramic particulates such as WC, TiC, W, or Mo in metal matrixes through traditional powder metallurgical or casting techniques. Resin-bonded composites are composed of particulate fillers such as silica flour, wood flour, mica, or glass spheres in phenol-formaldehyde (Bakelite), epoxy, polyester, or thermoplastic matrixes. [Pg.111]

For example, consider the crack tip as it intersects a fiber (Fig. 16). The local stresses at the tip can cause fiber-matrix debonding. The crack tip continues to open causing the interfacial debonded region to extend. The fiber continues to interact with the matrix through a frictional sliding force even after the initial bond fails. The distance over which the force acts is the debonded length times the difference in strain between the fiber and the matrix. [Pg.23]

In recent work by Arkles el al. [4, 5], it has been proposed that, in comparison with monomeric silanes, polymeric silanes may react with substrates more efficiently. A typical polymeric silane is shown in Fig. la, in which pendant chains of siloxanes are attached through methylene chain spacers to a polyethyleneimine backbone. The film-forming polymeric silane thus provides a more continuous reactive surface to the polymer matrix in the composite. In this case, the recurring amino groups on the polymeric silane backbone can react with an epoxy resin matrix through chemical bond formation. [Pg.474]

One further finding with the —lIRNMeR — pyrolysis studies comes from Raman studies of the ceramic product. The NMR data show no traces of Si—C bonds, nor does the Raman spectrum. However, the Raman spectrum does show the presence of C—N bonds up to 1200 °C (the highest temperature studied). This suggests that the silicon nitride nanoparticles interact with the carbon matrix through C—N bonds. One might speculate that the interface looks somewhat like C3N4. [Pg.2257]

Rates of non-adiabatic intramolecular electron transfer were calculated in Ref. [331] using a self-consistent perturbation method for the calculation of electron-transfer matrix elements based on Lippman-Schwinger equation for the effective scattering matrix. Iteration of this perturbation equation provides the data that show the competition between the through-bond and through-space coupling in bridge structures. [Pg.83]

Fig. 10 Orbital description of the McConnell superexchange (through-bond) mechanism applied to a system comprising a donor and an acceptor covalently linked to a pentamethylene chain. The donor and acceptor chromophores each contribute a single tt orbital to the interaction and each C-C bridge bond is assumed to contribute a single a or a MO, depicted as the former type in the figure. T is the interaction matrix element between a chromophore tt MO and the ally lie C-C a MO, and t is the interaction matrix element between two geminal C-C a MOs. Fig. 10 Orbital description of the McConnell superexchange (through-bond) mechanism applied to a system comprising a donor and an acceptor covalently linked to a pentamethylene chain. The donor and acceptor chromophores each contribute a single tt orbital to the interaction and each C-C bridge bond is assumed to contribute a single a or a MO, depicted as the former type in the figure. T is the interaction matrix element between a chromophore tt MO and the ally lie C-C a MO, and t is the interaction matrix element between two geminal C-C a MOs.
Fig. 21 Some through-bond coupling pathways in 15(4). The t3 matrix element is responsible for the through-space interactions (represented by a wavy line). The McConnell splitting energy contribution from each pathway is given, as are the signs of the interactions. Note that tt is negative for all values of i. Fig. 21 Some through-bond coupling pathways in 15(4). The t3 matrix element is responsible for the through-space interactions (represented by a wavy line). The McConnell splitting energy contribution from each pathway is given, as are the signs of the interactions. Note that tt is negative for all values of i.
Figure 7. Orbital description of the superexchange (through-bond) mechanism. T is the interaction matrix element between the n orbital and the C-C a orbital and t is the interaction matrix element between two geminal C-C a orbitals. Figure 7. Orbital description of the superexchange (through-bond) mechanism. T is the interaction matrix element between the n orbital and the C-C a orbital and t is the interaction matrix element between two geminal C-C a orbitals.
Figure 33. Through-bond coupling pathways in model C for 12(4). The fa matrix element is responsible for the cross-talk interactions (represented by wavy lines). The... Figure 33. Through-bond coupling pathways in model C for 12(4). The fa matrix element is responsible for the cross-talk interactions (represented by wavy lines). The...
Eewis, M. A., and Radebaugh, R., (2003) Measurement of Heat Conduction Through Bonded Regenerator Matrix Materials, Cryocoolers 12, R. G. Ross (ed.), Kluwer Academie/Plenum Publishers, New York, pp. 517-522. [Pg.124]


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See also in sourсe #XX -- [ Pg.12 ]




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