Low-ductility materials

Alloys of antimony, tin, and arsenic offer hmited improvement in mechanical properties, but the usefulness of lead is limited primarily because of its poor structural qualities. It has a low melting point and a high coefficient of expansion, and it is a veiy ductile material that will creep under a tensile stress as low as 1 MPa (145 IbFin"). 

The present trend of material seleeted for collection headers is toward Incoloy 800. The cast alloys used, HK and HT, have failed in most instances because of their inherently low ductility—especially after exposure to elevated temperature. It now appears that wrought alloys should be used in preference to cast alloys unless the higher creep strength of the east alloy is required and the inherently low ductility of the aged cast alloy is considered in the design. 

The PE separators have excellent microporous structure for electrolyte flow with minimal lead particle deposits excellent ductility, strength, and toughness for envelopability and plate puncture resistance excellent oxidation, chemical and thermal resistance to resist premature deterioration and good manufacturability with high production efficiency and relatively low raw material cost, which reduces overall manufacturing costs. The PE pocket sepa-... 

Cemented carbides possess high compressive strength but low ductility at room temperature, but at temperatures associated with metal-cutting these materials exhibit a small but finite amount of ductility. Measurement of yield strength is therefore more appropriate at higher temperatures. Like hardness, the compressive yield strength of cemented carbide decreases monotonically with increasing temperatures. 

The transition metal carbides do have a notable drawback relative to engineering applications low ductility at room temperature. Below 1070 K, these materials fail in a brittle manner, while above this temperature they become ductile and deform plastically on multiple slip systems much like fee (face-centered-cubic) metals. This transition from brittle to ductile behavior is analogous to that of bee (body-centered-cubic) metals such as iron, and arises from the combination of the bee metals strongly temperature-dependent yield stress (oy) and relatively temperature-insensitive fracture stress.1 Brittle fracture is promoted below the ductile-to-brittle transition temperature because the stress required to fracture is lower than that required to move dislocations, oy. The opposite is true, however, above the transition temperature. 

Solidification and deformation processes are very seldom used to fabricate bulk articles from ceramics and other materials with low ductility and malleability. These substances are brittle and suffer fracmre before the onset of plastic deformation. Additionally, ceramics normally have exceedingly high melting points, decompose, or react with most cm-cible materials at their melting temperatures. Many ceramics are worked with in powder form since the products of most solid-state chemical syntheses are powders. Fabricating a bulk part from a powder requires a consolidation process, usually compaction followed... 

Yet, for systems A and C, the measured fracture energies remain low compared with the critical fracture energy of the bulk aluminum 10 J Moreover, we do not observe islands of passivation material on the A1 fracture surface and, inversely, we do not observe A1 on debonded surfaces of the passivation films. This suggests that the loss of interfacial adhesion is close to a brittle fracture process despite the influence of plasticity of the A1 substrate and crack blunting at the interface. This sort of brittle mode of interfacial failure, including plastic flow in a ductile material (the substrate), has been observed or discussed for a sapphire/Au interface. ... 

By the first decade of this century it was established that material failures occur at such low stress levels, because real materials do not usually have a perfect crystalline structure and almost always some vacancies, interstitials, dislocations and different sizes of thin microcracks (having linear structure and sharp edges) are present within the sample. Since the local stress near a sharp notch may rise to a level several orders of magnitude higher than that of the applied stress, the thin cracks in solids reduce the theoretical strength of materials by similar orders, and cause the material to break at low stress levels. The failure of such (brittle or ductile) materials was first identified by Inglis (1913) to be the stress concentrations occurring near the tips of the microcracks present within the sample. 

Among low-temperature procedures widely used in the powder production of ductile materials are various kinds of cryodispersion or cryomilling methods based on mechanical comminution of materials at cryogenic temperatures. A decrease of the comminution temperature is accompanied by a corresponding... 

Many ceramic materials possess improved biocompatibility as compared to metals, and corrosion is typically not an issue. Ceramics often have high strength but display brittleness, poor crack resistance, and low ductility. Several ceramic materials are bioinert, bioactive (forming bonds with the surrounding tissue such as bone), or bioresorbable (as in the case of some porous ceramics). ... 

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