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Lignin Bakelite resins

Phenol-methanal adhesives are currently used in about one tenth of all plywood and particle board. The binding technology represented by these Bakelite resins would be more widely applied if the reagents, particularly the phenol, were cheaper. Using lignin in place of phenol will sharply reduce the cost of the binder [26]. Unfortunately, lignin is not structurally equivalent to phenol. [Pg.133]

Recent work has concentrated on the use of ALCELL lignin as a substitute for phenol-formaldehyde resins in wood adhesives, particularly wafer-board. Some of the results obtained when a PF resin (Bakelite 9111) was replaced with different levels of hardwood ALCELL lignin in waferboard manufacture will be briefly discussed below. Table III shows the conditions used for waferboard manufacture. [Pg.321]


See other pages where Lignin Bakelite resins is mentioned: [Pg.8]    [Pg.83]    [Pg.129]    [Pg.296]    [Pg.136]    [Pg.87]    [Pg.179]   
See also in sourсe #XX -- [ Pg.83 ]




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