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Integrated circuit device elastomers

Thermogravinietric Analysis of Silicone Elastomers as Integrated Circuit Device Encapsulants... [Pg.285]

In this paper, the thermal stability of the silicone elastomers, base silicone resins, fillers, and their interactions with each other within the silicone matrix are described. Thermal decomposition volatiles, obtained indirectly through solvent extractables, reaction kinetics of the materials as integrated circuit (IC) devices encapsulants will be discussed. [Pg.285]

RTV silicone elastomer, an organosiloxane, is one of the most effective encapsulants used for temperature cycling and moisture protection of IC devices. Since World War II, silicones (organosiloxane polymers) have been used in a variety of applications where properties of high thermal stability, hydrophobicity, and low dielectric constant are necessary, e.g., as encapsulants or conformal coatings for integrated circuits. In 1969 it was demonstrated that room temperature vulcanized (RTV) silicones exhibited excellent performance as moisture protection barriers for IC devices and a number of different RTV silicone have been adapted For use in the elec-tronics industry... [Pg.76]

See other pages where Integrated circuit device elastomers is mentioned: [Pg.438]    [Pg.509]    [Pg.217]    [Pg.228]    [Pg.278]    [Pg.76]    [Pg.253]    [Pg.275]    [Pg.151]   
See also in sourсe #XX -- [ Pg.285 , Pg.286 , Pg.287 , Pg.288 , Pg.289 , Pg.290 , Pg.291 , Pg.292 , Pg.293 , Pg.294 , Pg.295 , Pg.296 , Pg.297 , Pg.298 , Pg.299 , Pg.300 , Pg.301 , Pg.302 ]



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