Gold-copper system

Okamoto, H., Massalski, T.B., Chakrabarti, D.J. and Laughlin, D.E. (1987) The Au-Cu (gold-copper) system. In Phase Diagrams of Binary Gold Alloys, ed. Okamoto, H. and Massalski, T.B. (ASM International, Materials Park, OH). 

Copper electrodes Copper foil Copper fungicides Copper glycinate Copper-gold Copper halide Copper halide system... 

Copper [7440-50-8] Cu, produces a reddish color and reduces the melting pokit of the alloy. It produces heat-treatable compositions with gold, platinum, and palladium that result ki kicreased hardness, strength, and generally improved physical properties. The tarnish resistance of the alloy is usually decreased. The gold—copper, Au—Cu, system is the fundamental system of many dental gold alloys. Copper has a useful range of 0—20 wt %. 

Gold-copper alloys exhibit exceptional resistance to corrosion, and have very low vapour pressures. Gold-nickel alloys, with similar low vapour pressure, are somewhat stronger than gold-copper at high temperatures. Both series of alloys are widely employed in vacuum systems. 

Bouley, B.A., St. George, P., Wetherbee, P.K. 1995. Geology and discovery at Pebble Copper, a copper-gold porphyry system in southwest Alaska, In Schroeder, T.G. (ed.). Porphyry deposits of the northwest Cordillera of North America Canadian Institute of Mining, Metaiiurgy, and Petroieum, Special Volume 46, 422-435. 

A liquid gold-copper alloy contains 45mol% of copper and behaves ideally at 1,320K. Calculate the amount of heat absorbed in the system when Ig of solid copper is dissolved isothermally at this temperature in a large bath of the alloy of this composition. The following dam given ... 

Figure 3.22. Unit cell representations of two varieties of AuCu superlattices. For the AuCu II superlattice, M refers to the length of repeat unit, and APB indicates the antiphase boundaries between adjacent periodic arrays. Republished with the permission of the International and American Associations for Dental Research, from Determination of the AuCu Superlattice Formation Region in Gold-Copper-Silver Ternary System , Uzuka, T. Kanzawa, Y. Yasuda, K. J. Dent. Res. 1981, 60, 883 permission conveyed through Copyright Clearance Center, Inc.

In addition, several issues arise with the use of either RIE etch back or CMP to remove the metal from on top of ILD. Dual layw inlaid metal schemes have been demonstrated for tungsten, aluminum, copper,and gold metallization systems. 

There are only a few systems, where the two components are closely similar in nature, in which the liquidus and solidus curves are given by the simple equations (23.3). As examples we may mention the systems chlorobenzene+ bromobenzene, silvers gold, copper + nickel, and certain pairs of optical isomers. The data for the system copper +nickel ... 

Any one of these mechanisms may apply in specific instances of dealloying. For example, twin bands in brass, visible in the completely or incompletely dezincified layer, constituted early evidence for a volume diffusion mechanism of zinc transport from the bulk alloy to the surface [26]. In the gold-copper alloy system, copper corrodes preferentially, without dissolution of gold, leaving a porous residue of gold-copper alloy or pure gold. 

Despite the limited number of examples reported in the literature concerning the antimicrobial activity of gold-NHC systems and the numerous studies of silver species, no research on this subject has been reported with copper analogs. 

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