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Gluing bonding process

The properties of wood-based panels are determined, in principle, by three parameters wood, adhesive, and processing conditions. Only if all of these three parameters are correct and well balanced in the wood bonding process, can proper bonding results be achieved. The influence of the first parameter, wood, involves several factors. Bonded wood often is described as a chain of several links wood (substance), wood surface, interface between wood and adhesive, surface of the glue line (boundary layer), and glue line itself. As is true for all such chains, the weakest link determines the strength of the chain, and in wood gluing this is in most cases the interface. [Pg.921]

Overmolding is the process by which two different materials are joined into one assembly without using secondary operations like gluing or welding. In case the materials are chemically compatible, chemical bonds may form between them and so mechanical interlocks are not required. There are two common techniques of overmolding—insert molding and multiple-shot injection molding. [Pg.146]

After the DRIE-process the second glass wafer is bonded on top of the silicon structures to close the plasma and the ionization chamber. It also serves to mechanically stabilize the system. To install the electrical contacts and the gas supply the PIMMS chip is glued to a PCB and the gold pads of the chip are connected via wire bonding to the PCB. After that, as described in Sect. 4, capillaries are glued to the plasma-/ionization-chamber inlet to connect the PIMMS to plasma and sample gas supplies. [Pg.445]

Little is known about the peroxide activation process in BCcPs. However, the NEP structure revealed a peroxidebinding site quite different from the more traditional peroxidases. BCcPs do not have a distal His that serves as the catalytic acid-base required for heterolytic cleavage of the peroxide 0-0 bond. The NEP structure has a Glu residue directly adjacent to the peroxide-binding site that most likely operates as the acid-base catalyst. The only other peroxidase known to have a Glu in this position is chloroperoxidase. " ... [Pg.1946]


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See also in sourсe #XX -- [ Pg.376 , Pg.377 , Pg.378 , Pg.379 ]




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Gluing

Processing bonding

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