Flip chip on board

Flip-chip in package or flip-chip on board... [Pg.237]

Staychip 3100/ Cookson High-Tg, aromatic-amine cured epoxy (sihca filled) <1 Ceramic, laminates Dispense, capillary underfill FUp-chip in package or flip-chip on board... [Pg.292]

Loctite 3594/ Loctite Fluxing (no-flow) underfill NA Device passivations, OSP - copper, copper-nickel-gold Automated pattern dispense Flip-chip-on-board using SMT reflow profiles. Suitable for high-fi-equency applications ( - 2.9 at 100 kHz). [Pg.294]

FP4526/ Loctite Fast-flow, epoxy underfill 3 Ceramic, solder masks and polyimide Automated, 22-gauge needle Flip-chip-on-board... [Pg.294]

FluxFill 2000/ Loctite No-flow, fluxing underfill (volcano reflow) Not applicable CSP (ceramic), FCOB (silicon with passivation) and OSP -copper, copper-nickel-gold, and PWBs Dispense, 18-gauge needle 10 psi Fluxing CSP or flip-chip on board (volcano cycle)... [Pg.295]

Amicon E 1172/ Emerson Cuming Fast-flow, nonanhydride capillary-flow underfill >1 mil Laminates Automated dispensing (21-gauge needle) CSP, BGA, and Flip-chip on board... [Pg.295]

Alternatively, a low-melting-temperature solder (e.g., the eutectic Pb-Sn alloy) may be utilized to attach a silicon chip (having high-Pb, Pb-Sn solder bumps) to organic printed circuit boards. The circuit boards are not damaged by the low-temperature solder attachment process. This version of flip chip assembly is referred to as direct chip attach (DCA) or flip chip on board (FCOB) technology. [Pg.194]

Nysaether, J.B. Lai, Z. Liu, J. Isotropically conductive adhesives and solder bumps for flip chip on board circuits—a comparison of lifetime under thermal cychng. Proceedings of the 3rd International Conference on Adhesive Joining and Coating Technology in Electronics Manufacturing, Binghamton, NY, September 1998 125-131. [Pg.766]

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