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Fillers silver

Figure 5.11. UV-Vis spectra of (a) solid nanocomposite matrix (insert pure polystyrene), (b) nanocomposite matrix in chloroform (insert 1,4-dipheny-l,3-butadiene), and (c) nanocomposite filler (silver nanoparticles). Figure 5.11. UV-Vis spectra of (a) solid nanocomposite matrix (insert pure polystyrene), (b) nanocomposite matrix in chloroform (insert 1,4-dipheny-l,3-butadiene), and (c) nanocomposite filler (silver nanoparticles).
The result of these arrangements will be homogeneous metal particles/ nanocomposites distribution in acetylacetone ligand shell. In the capacity of conductive filler silver nanoclusters/nanocrystals and copper-nickel/ carbon nanocomposites can be used. It should be lead to decrease volume resistance from 10" to 10" Q-cm and increase of adhesive/paste adhesion. [Pg.213]

For many electronic and electrical appHcations, electrically conductive resias are required. Most polymeric resias exhibit high levels of electrical resistivity. Conductivity can be improved, however, by the judicious use of fillers eg, in epoxy, silver (in either flake or powdered form) is used as a filler. Sometimes other fillers such as copper are also used, but result in reduced efficiency. The popularity of silver is due to the absence of the oxide layer formation, which imparts electrical insulating characteristics. Consequently, metallic fibers such as aluminum are rarely considered for this appHcation. [Pg.531]

Table 6. Chemical Composition Requirements for Silver Filler Metals ... Table 6. Chemical Composition Requirements for Silver Filler Metals ...
An interesting example of judicious choice of braze filler is to be found in the selection of silver alloys for the brazing of stainless steels to be subsequently used in a tap-water environment . Although the brazed joint may appear to be quite satisfactory, after a relatively short exposure period failure of the joint occurs by a mechanism which appears to be due to the break-down of the bond between the filler and the base metal. Dezincifica-tion is a prominent feature of the phenomenon and zinc-free braze alloys based on the Ag-Cu system with the addition of nickel and tin have been found to inhibit this form of attack. A similar result is obtained by electroplating 0-007 mm of nickel over the joint area prior to brazing with a more conventional Ag-Cu-Zn-Cd alloy. [Pg.89]

Porous refractory (tungsten) infiltrated with a low melting point metal (silver) Hot-pressed refractory metal containing an oxide filler... [Pg.119]

The use of reinforcing fillers was examined by Seed Wilson (1980). An alumina-fibre cement had a flexural strength of 44 MPa, while one reinforced by carbon fibre had a flexural strength of 53 MPa. Metal reinforcement has also been examined. Seed Wilson (1980) found that a cement reinforced with silver-tin alloy had a flexural strength of 40 MPa. [Pg.163]

Electrical conduction ceramics, 5 585-587 glasses, 5 592-593 Electrical conductivity. See also Conductivity of foams, 12 11 fillers and, 10 434 silver, 22 639... [Pg.300]

The brazing process(es) and method are limited to silver filler metal/manual torch brazing. [Pg.42]

Recently Serenyl used a flexible alkaline separator (FAS) in Silver—Zinc cells, which consists of a microporous polyolefin film, with inorganic filler. This can be folded around the silver and/or zinc electrodes to form conventional U wraps or heat sealed bags. They showed that the FAS was not attacked by the electrolyte and helps in inhibiting the shape change of zinc electrode. [Pg.215]

Composite-based PTC thermistors are potentially more economical. These devices are based on a combination of a conductor in a semicrystalline polymer—for example, carbon black in polyethylene. Other fillers include copper, iron, and silver. Important filler parameters in addition to conductivity include particle size, distribution, morphology, surface energy, oxidation state, and thermal expansion coefficient. Important polymer matrix characteristics in addition to conductivity include the glass transition temperature, Tg, and thermal expansion coefficient. Interfacial effects are extremely important in these materials and can influence the ultimate electrical properties of the composite. [Pg.595]

Kumar, R., Howdle, S. and Munstedt, H. (2005) Polyamide/silver antimicrobials Effect of filler types on the silver ion release. /. Biomed. Mater. Res. Appl. Biomater., 75 (2), 311—319. [Pg.248]

Electronic devices can also generate electromagnetic and radio frequency interference waves that can interfere with other electronic devices. These waves must be modulated and leakage to the environment prevented. Plastics, silicones, acrylics, and polyesters (qv) that are filled with conductive fillers, such as silver, nickel, and copper, are used for this application (1). Although nickel-filled polymers are low cost and efficient, these are not preferred because of the carcinogenic nature of nickel powder. [Pg.124]

Explosives Removal of High Explosive Fillers by Chemical Dissolution , NOLTR-73-186, Naval Ordn Lab, Silver Spring (1972) 48) D.S. [Pg.759]

Polyaromatic hydrocarbons Silver membrane filler, cyclohexane extraction Dimethysilated Chromosorb-9, 175-275°C Split flame ionisation and ultraviolet detection Combination of GLC and ultraviolet spectroscopy [641]... [Pg.340]

Electrically conductive adhesives owe their conductivity as well as their high cost to the incorporation of high loadings of metal powders or other special fillers of the types shown in Table 9.8. If enough metal particles are added to form a network within the polymer matrix, electrons can flow across the particle contact points, making the mixture electrically conductive. Virtually all high-performance conductive products today are based on flake or powdered silver. Silver offers an advantage in conductivity stability that cannot... [Pg.171]


See other pages where Fillers silver is mentioned: [Pg.1782]    [Pg.249]    [Pg.1782]    [Pg.249]    [Pg.245]    [Pg.344]    [Pg.167]    [Pg.230]    [Pg.305]    [Pg.73]    [Pg.241]    [Pg.228]    [Pg.228]    [Pg.941]    [Pg.89]    [Pg.89]    [Pg.1265]    [Pg.507]    [Pg.93]    [Pg.151]    [Pg.589]    [Pg.42]    [Pg.428]    [Pg.482]    [Pg.271]    [Pg.195]    [Pg.127]    [Pg.249]    [Pg.713]    [Pg.256]    [Pg.257]    [Pg.296]    [Pg.344]    [Pg.310]    [Pg.521]    [Pg.169]    [Pg.432]   
See also in sourсe #XX -- [ Pg.363 ]




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