Exposure, substrate

FIGURE 17.4. Differential particle size distrihution of B(a)P carhon black aerosol (100 pg/m ). Subsequent to exposure, substrate post-weights were recorded and entered into the Win-CIDRS (Windows-Cascade Impactor Data Reduction Program) to generate the particle size distribution for the particulate aerosol. From Hood et al. (2000). 

Fig. 15.4 (a) Particle density of various metals, grown on vacuum-cleaved NaCl(OOl) at different substrate temperatures (metal exposure 0.8 nm, except for Re (0.24 nm)). (b) The mean diameter of Pd nanoparticles grown on vacuum-cleaved NaCl(OOl), as a function of metal exposure (substrate temperatures indicated). Adapted in part from [18] with permission. Copyright 1995 Elsevier... 

The resist must have suitable radiation sensitivity. Today s exposure tools are so costiy that tool throughput is a key measure of performance. The overall time to expose a resist film is the sum of the times to load and position the substrate in the exposure tool, to align the substrate and the mask, to irradiate the film, and to unload the complete part. In the optimum case the resist exhibits sufficient radiation sensitivity so that the fraction of the overall cycle apportioned to irradiate the film does not limit the number of substrates exposed in a given period of time. 

Gate oxide dielectrics are a cmcial element in the down-scaling of n- and -channel metal-oxide semiconductor field-effect transistors (MOSEETs) in CMOS technology. Ultrathin dielectric films are required, and the 12.0-nm thick layers are expected to shrink to 6.0 nm by the year 2000 (2). Gate dielectrics have been made by growing thermal oxides, whereas development has turned to the use of oxide/nitride/oxide (ONO) sandwich stmctures, or to oxynitrides, SiO N. Oxynitrides are formed by growing thermal oxides in the presence of a nitrogen source such as ammonia or nitrous oxide, N2O. Oxidation and nitridation are also performed in rapid thermal processors (RTP), which reduce the temperature exposure of a substrate. 

A sealant s adhesion is commonly studied by 180 degree peel tests such as ASTM C794 or by tensHe/adhesion joints tests such as ASTM C719. The adhesion test protocol should simulate actual field conditions as closely as possible. Sealants often have good adhesion to dry substrates, but this adhesion may be quickly destroyed by water. Because most sealants are exposed to water over their lifetime, adhesion testing should include exposure to water for some length of time. ASTM C719 is one of the better tests to determine a sealant s adhesion durabHity as it exposes sealants to seven days of water immersion. 

Antioxidants are used to retard the reaction of organic materials with atmospheric oxygen. Such reaction can cause degradation of the mechanical, aesthetic, and electrical properties of polymers loss of flavor and development of rancidity ia foods and an iacrease ia the viscosity, acidity, and formation of iasolubles ia lubricants. The need for antioxidants depends upon the chemical composition of the substrate and the conditions of exposure. Relatively high concentrations of antioxidants are used to stabilize polymers such as natural mbber and polyunsaturated oils. Saturated polymers have greater oxidative stabiUty and require relatively low concentrations of stabilizers. Specialized antioxidants which have been commercialized meet the needs of the iadustry by extending the useflil Hves of the many substrates produced under anticipated conditions of exposure. The sales of antioxidants ia the United States were approximately 730 million ia 1990 (1,2). 

Photochromic silver—copper haUde films were produced by vacuum evaporation and deposition of a mixture of the components onto a sUicate glass substrate (13). The molar ratio of the components was approximately 9 1 (Ag Cu) and film thicknesses were in the range of 0.45—2.05 p.m. Coloration rate upon uv exposure was high but thermal fade rates were very slow when compared with standard silver haUde glass photochromic systems. 

An extensive survey of accelerated test methods for anticorrosive coating performance which emphasizes the need to develop more meaningful methods of testing has been pubUshed (129). The most powerful tool available is the accumulated material in data banks correlating substrate, composition, apphcation conditions, and specifics of exposure environments with performance. 

Humidity can be a problem. Whereas it was shown (284) that 33% RH was best for spore inactivation, and that at least 30% RH was needed for effective sterilisation (285), dried spores are difficult to kill, and the spore substrate material and wrappings compete with the spore for the available moisture (286). Therefore, the relative humidity is adjusted to 50—70% to provide sufficient moisture for the spores to equiUbrate. The exposure time depends upon the gas mixture, the concentration of ethylene oxide, the load to be sterilised, the level of contamination, and the spore reduction assurance requited. It may be anywhere from 4—24 hours. In a mn, cycles of pre-conditioning and humidification, gassing, exposure, evacuation, and air washing (Fig. 9) are automatically controlled. 

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