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Expansion-induced stress potential

Patients with CKD are at increased risk of cardiovascular disease, independent of the etiology of their kidney disease. While a clearly unique pathogenesis of cardiovascular disease specific to CKD has not been identified, it is known that manifestations of kidney disease are contributory. Risk factors for cardiovascular disease in this population include hemodynamic and metabolic abnormalities, as well as hypertension, dyslipidemia, elevated homocysteine levels, anemia, hyperparathyroidism, malnutrition, and oxidative stress. Hypertension induced by volume expansion and increased systemic vascular resistance increases myocardial work and contributes to development of left ventricular hypertrophy (LVH). Hyperlipidemia may enhance atherogenesis, while some uremic toxins can decrease myocardial contractflity. In addition, uremic toxins can induce pericarditis, a potentially fatal complication. Currently, measures to screen this high-risk population for cardiovascular risk factors are not routine. ... [Pg.823]

There are two additional considerations that we raise here as areas of potential concern, which are beyond the scope of this overview as they are related to the specific characteristics of the solid storage media. However, it is important to raise awareness of these issues. The first consideration is stress in the containment material induced by expansion of the solid storage media during absorption or desorption of hydrogen. Such stresses can, in principle, be quite large and should be considered in addition to the stress associated with the gas pressure. The second consideration is potential chemical... [Pg.52]

The advantages of stacked die packaging are further enhanced by using thinned die. Thinning die has the potential of enhancing first-level interconnect reliability while minimizing the increase in vertical profile. A silicon die with a thickness <100 jum is quite flexible and can relieve stresses induced by packaging and coefficient of thermal expansion (CTE) mismatch. ... [Pg.89]


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