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Examples of Practical Post-CMP Cleaning Processes

As CMP materials are constantly progressing, it would be delusive to propose definitive practical recipes. However, taking into account all the elements previously set out, some cleaning processes using a scrubber or wet chemistries adapted to some typical CMP situations can be proposed for example purposes (see Table II). [Pg.210]

Examples of Post-CMP Cleanings Performed by Scrubbing or by Wet Processes [Pg.211]

Application Wafer Slurries Station 1 Station 2 Step 1 Step 2 [Pg.211]

Tungsten SiOj Ab03 NH4OH Meg. HF -1-surfactant Hot iINHj Power Meg. HF/HCl dip [Pg.211]

Copper SiOj AI3O3 Water -(-surfactant -(-corrosion inhibitor Meg. HF -1-surfactant -E corrosion inhibitor HF -(-surfactant -E corrosion inhibitor Power Meg.  [Pg.211]


See other pages where Examples of Practical Post-CMP Cleaning Processes is mentioned: [Pg.183]    [Pg.210]   


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