Epoxy resin encapsulant

Coilife [Westinghouse]. TM for special epoxy resin encapsulation of random-wound stators using solventless epoxy-resin formulations and rotational seasoning. 

Recent developments in the construction and civil engineering industry include the development of intelligent concrete with self-healing capability in Japan (249). Some of the systems are based on epoxy resins encapsulated in concrete which when triggered by cracks open and cure to repair the concrete. 

The basic needs for either thermocycling or thermal shock improvements in epoxy resin encapsulants (and, to some extent, in molded insulations and coatings) have occasioned the examination of the utility of elastomer-modified epoxy resin systems. Carboxy-terminated liquid polymers have been shown to provide a... 

Bisphenol A. One mole of acetone condenses with two moles of phenol to form bisphenol A [80-05-07] which is used mainly in the production of polycarbonate and epoxy resins. Polycarbonates (qv) are high strength plastics used widely in automotive appHcations and appHances, multilayer containers, and housing appHcations. Epoxy resins (qv) are used in fiber-reinforced larninates, for encapsulating electronic components, and in advanced composites for aircraft—aerospace and automotive appHcations. Bisphenol A is also used for the production of corrosion- and chemical-resistant polyester resins, polysulfone resins, polyetherimide resins, and polyarylate resins. 

The binder system of a plastic encapsulant consists of an epoxy resin, a hardener or curing agent, and an accelerating catalyst system. The conversion of epoxies from the Hquid (thermoplastic) state to tough, hard, thermoset soHds is accompHshed by the addition of chemically active compounds known as curing agents. Flame retardants (qv), usually in the form of halogens, are added to the epoxy resin backbone because epoxy resins are inherently flammable. 

Thermosetting-encapsulation compounds, based on epoxy resins (qv) or, in some niche appHcations, organosiHcon polymers, are widely used to encase electronic devices. Polyurethanes, polyimides, and polyesters are used to encase modules and hybrids intended for use under low temperature, low humidity conditions. Modified polyimides have the advantages of thermal and moisture stabiHty, low coefficients of thermal expansion, and high material purity. Thermoplastics are rarely used for PEMs, because they are low in purity, requHe unacceptably high temperature and pressure processing conditions. 

The majority of 2-methylphenol is used in the production of novolak phenoHc resins. High purity novolaks based on 2-methylphenol are used in photoresist appHcations (37). Novolaks based on 2-methylphenol are also epoxidized with epichlorohydrin, yielding epoxy resins after dehydrohalogenation, which are used as encapsulating resins in the electronics industry. Other uses of 2-methylphenol include its conversion to a dinitro compound, 4,6-dinitro-2-methylphenol [534-52-1] (DNOC), which is used as a herbicide (38). DNOC is also used to a limited extent as a polymerization inhibitor in the production of styrene, but this use is expected to decline because of concerns about the toxicity of the dinitro derivative. 

The positive plates are siatered silver on a silver grid and the negative plates are fabricated from a mixture of cadmium oxide powder, silver powder, and a binder pressed onto a silver grid. The main separator is four or five layers of cellophane with one or two layers of woven nylon on the positive plate. The electrolyte is aqeous KOH, 50 wt %. In the aerospace appHcations, the plastic cases were encapsulated in epoxy resins. Most usehil cell sizes have ranged from 3 to 15 A-h, but small (0.1 A-h) and large (300 A-h) sizes have been evaluated. Energy densities of sealed batteries are 26-31 W-h/kg. 

Epoxy resins have outstanding mechanical and electrical properties, dimensional stability, resistance to heat and chemicals, and adhesion to other materials. They are used for casting, potting, encapsulation, protective coatings, and adhesives. Epoxy glues separate the resin from the curing. igciU to be mixed just prior to use. 

This structure has superior water-resistant properties in comparison to conventional polyols used for PU synthesis. Room temperature cures are easily obtained with typical urethane catalysts. Short chain diols, fillers and plasticizers may also be used in their formulations in order to vary physical properties. Formulations usually with NCO/OH ratio of 1.05 are used for this purpose. Such urethanes are reported to be flexible down to about -70 °C. HTPB is regarded as a work horse binder for composite propellants and PBXs. HTPB also successfully competes with widely used room temperature vulcanizing (RTV) silicones and special epoxy resins for the encapsulation of electronic components. HTPB-based PUs are superior in this respect as epoxy resins change their mechanical properties widely with temperature. 

Disk thermistors can be produced to dose limits of interchangeability, eg, 0.1 and 0.05° C. Disks cannot be made as small as the smallest beads 2 mm diameter seems an approximate practicable limit. Disks historically have been considered to be less stable than good beads. They are commonly protected with a coating of epoxy resin, which provides less compressive support than the glass coating of bead thermistors. More recent developments have resulted in interchangeable glass-encapsulated disk thermistors which have the stability characteristics of the best beads. 

Ho, T., et al., Modification of Epoxy Resins with Polysiloxane TPU for Electronic Encapsulation, Journal of Applied Polymer Science, vol. 60, 1996, p. 1097. 

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