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Electronic components, process

Electronics Industry. Organic materials on the surface of electronic components are oxidized by immersion in deionized water that contains 0.5—2 ppm ozone residual. In some cases, gaseous ozone is employed to oxidize organic films on the surface of electronic components. In this treatment process, 5—6 wt % ozone, made in an oxygen-fed generator, is required. [Pg.502]

Potting. Potting is the simplest cavity-filling process. It involves placing the electronic component within a container, filling the container with a... [Pg.192]

Another important factor is the corrosiveness of the adhesive. This may be especially important in those cases where the PSA has direct contact with the bare wire, the electronic component, or the silicon wafer in a dicing operation. In those cases where an electrical current is running through the device, electrolytic corrosion processes may occur, especially if moisture can penetrate into the adhesive or bond line. [Pg.518]

In redox initiation, the free radicals that initiate the polymerization are generated as transient intermediates in the course of redox reaction. Essentially this involves an electron transfer process followed by scission to give free radicals. A wide variety of redox reactions, involving both organic and inorganic components either wholly... [Pg.485]

The redox properties of quinones are crucial to the functioning of living cells, where compounds called ubiquinones act as biochemical oxidizing agents to mediate the electron-transfer processes involved in energy production. Ubiquinones, also called coenzymes Q, are components of the cells of all aerobic organisms, from the simplest bacterium to humans. They are so named because of their ubiquitous occurrence in nature. [Pg.632]

For the electronic component industry, different types of plastics and processes are extensively used. Not too evident is the high powered action of electronics in the plastic toy industry. The digital revolution has opened up a variety of new applications in smart microprocessor-based toys that use technology in innovative ways. Foremost player is the MIT Media Laboratory s Toys of Tomorrow (TOT) consortium that was organized in April 1998. [Pg.229]

Polyimide It is a high-cost heat and fire resistant plastic, capable of withstanding 500°F (260° C) for long periods and up to 900°F (482° C) for limited periods without oxidation. It is highly creep resistant with good low friction properties. It has a low coefficient of expansion and is difficult to process by conventional means. It is used for critical engineering parts in aerospace, automotive and electronics components subject to high heat, and in corrosive environments. [Pg.429]

The basic steps of the IM process produce unique structures in all molded products, whether they are miniature (micro) electronic components, compact discs, or large automotive bumpers. These structures have frequently been compared to plywood with several distinct layers, each with a different set of properties. In all IM products, a macroscopic skin-core structure results from the flow of melt into an empty cavity. Identifiable zones or regions within the skin are directly... [Pg.467]

Since the end of the 1970s, the polyimides have been introduced for the production of electronic components mainly for the passivation. But more and more they are interesting for the integrated circuits and multichip modulus fabrications. Processability and dielectric and thermomechanical properties are the most attractive features of these materials for the electronic31 and electro-optical applications.32... [Pg.269]

Chemical vapor deposition (C VD) is a versatile process suitable for the manufacturing of coatings, powders, fibers, and monolithic components. With CVD, it is possible to produce most metals, many nonmetallic elements such as carbon and silicon as well as a large number of compounds including carbides, nitrides, oxides, intermetallics, and many others. This technology is now an essential factor in the manufacture of semiconductors and other electronic components, in the coating of tools, bearings, and other wear-resistant parts and in many optical, optoelectronic and corrosion applications. The market for CVD products in the U.S. and abroad is expected to reach several billions dollars by the end of the century. [Pg.25]

The beating of a faint source with a high power coherent source is a well known process to detect its phase and amplitude. The same detection equipment allows the evaluation of the power of the source with theoretical limits similar to a noiseless photon counter. Such detection apparatus are limited by the bandwidth of the electronic component as this bandwidth is rapidly increasing, this may be a competitive solution for quantum limited detection in the far infra red. The phase of a thermal source is an useless information ... [Pg.372]

Shredded circuit boards. Circuit boards are metal boards that hold computer chips, thermostats, batteries, and other electronic components. Circuit boards can be found in computers, televisions, radios, and other electronic equipment. When this equipment is thrown away, these boards can be removed and recycled. Whole circuit boards meet the definition of scrap metal, and are therefore exempt from hazardous waste regulation when recycled. On the other hand, some recycling processes involve shredding the board. Such shredded boards do not meet the exclusion for recycled scrap metal. In order to facilitate the recycling of such materials, U.S. EPA excluded recycled shredded circuit boards from the definition of solid waste, provided that they are stored in containers sufficient to prevent release to the environment, and are free of potentially dangerous components, such as mercury switches, mercury relays, nickel-cadmium batteries, and lithium batteries. [Pg.494]


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