Electronic circuits, direct assembly

The electronics needed to operate six temperature sensors on each microreactor channel are located underneath these cards. The ribbon connector, which is also visible in Fig. 12.8, is used to transfer electrical signals directly from the reactor board to the heater circuit board (described below). Serial communications for the Redwood flow manifolds is provided by two, four-conductor RJ-11 jacks on the front. The front of the board has gas inlets for the reactor feed and the purge gas. In addition, there are two gas outlets, one for each reaction channel. The inlet and outlet fittings are 1/16-inch type 316L stainless steel. The tubing assembly component having the greatest pressure sensitivity is the microreactor membrane. 

The EMC directive allows CE marking of components that (1) have an intrinsic function and (2) are sold to the end user, but not when sold to manufacturer s or assemblers. Some components may bear CE marking under the EMC directive. Examples of components include personal computer circuit cards, computer disk drives, PLCs, stand-alone power supplies, electric motors (except induction), and electronic temperature controls. 

Environmental legislation such as the European Union s Restriction of Hazardous Substances (RoHS) directive has a profound impact on all levels of the electronics supply chain, including these components. RoHS restricts the use of lead, which is an element in the solder used for component assembly onto printed circuits. The impact on the base materials and components is primarily the result of higher assembly temperatures that are associated with lead-free assembly. Table 7.1 summarizes the key issues for base material components. RoHS issues will be discussed further in Chap. 10. 

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