Electron beams curing systems

For large pieces, electron-beam (EB) curing can also be used. Electron-beam curing systems are similar in composition to UV systems. 

Janke, C.J., Lopata, V.J., Havens, S.J., Dorsey, G.F. and Moulton, R.J., High energy electron beam curing of epoxy resin systems incorporating cationic photoinitiators, US Patent 5,877,229, 1999. 

Lithographic Evaluation. Films were spin-coated onto silicon substrates from 10% solutions in chlorobenzene and prebaked at temperatures between 90 °C and 100°C for 1 hour to ensure solvent removal. The thickness of each film was about 5000 A. Electron beam exposures were performed on the AT T Bell Laboratories electron beam exposure system (EBES-I) operating at 20 kV with a beam adress and spot size both equal to 0.25 . A minimal cure time was required since there is no post-exposure reaction (4,16). 

It Is the purpose of this paper to examine the role of functionality of MFA and MFMA In the enhancement process In reactions using the copolymerisation of styrene In methanol to the polyolefins under the Influence of UV as model system. The results will be extrapolated to ionising radiation work. In addition, synergistic effects Involving these MFAs and other additives in both UV and radiation grafting processes will be reported. The significance of the data In UV and electron beam curing reactions will be discussed. 

The contributions of physics to adhesion are further manifested by the extension of uv- and electron-beam curing of adhesives to low temperatures. Radiation-curable adhesives were originally intended to eliminate solvents in the systems. However, the use of certain toxic acrylate monomers presented some problems. So far, radiation-curable systems have become technologically challenging, but economically less attractive than most thermally cured systems. Since one of the earliest papers on photoadhesives by Nakano (35) many patents have been issued on this subject. Two reviews have been published by Stueben (36). ... 

It has been shown that in many cases for thermoset systems, there is a quantitative relationship between the chemical conversion of the thermoset and its Tg value, independent of the time-temperature cure history (111). This is very convenient from an applications standpoint because measurement of Tg is equivalent to a direct measurement of conversion. It implies that either the molecular structure at a given degree of conversion is the same, regardless of the reaction path, or that differences in the structures produced for different reaction paths do not affect Tg. While a Tg-degree of cure relationship has been found valid for many epoxy-amine and other thermoset materials, it has been observed not to hold in some cases, which include some epoxy-DICY, cyanate-ester, and phenolic systems. It has also been found not to hold for a given resin system cured by two different methods such as thermal and microwave (112) or thermal and electron beam cures (113). 

Moschler, Jr., T. G. Rials and Ting Song, P. M. Winistorfer, Chang Song, 2006. Electron-Beam Cured Resin Systems for Wood Conposites, ANTEC2006, May 6-11, 2006, Charlotte NC. 

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