Electron beam curing liquid systems

The main sources of energy for curing epoxy adhesives by radiation are electron beam (EB) and ultraviolet light (uv). Both provide instantaneous curing of resins that polymerize from a liquid to a solid when irradiated. The uv systems account for approximately 85 percent of the market for radiant cured adhesives, EB systems account for about 10 percent, and the remainder are chiefly adhesives that can cure by exposure to both visible and infrared light. 

Formulation details are then presented in Chapters 11 through 14 for the various possible forms of epoxy adhesive systems room temperature and elevated-temperature curing liquids, pastes, and solids. The more or less unconventional forms of epoxy adhesives are also identified and discussed, since these are now achieving prominence in industry. These include uv and electron beam radiation curable, waterborne systems, and epoxy adhesives capable of curing via the indirect application of heat or energy. 

The second means of transforming a liquid adhesive entirely into a solid without the loss of a solvent or dispersion medium is to produce solidification by a chemical change rather than a physical one. Such reactive adhesives may be single-part materials that generally require heating or exposure to electron beam or UV or visible radiation (see Radiation-cured adhesives) to perform the reaction, and which may be solids (that must be melted before application), liquids or pastes. The alternative two-part systems require the reactants to be stored separately and mixed only shortly before application. The former class is exemplified by the fusible, but ultimately reactive, epoxide film adhesives and the latter by the two-pack Epoxide adhesives and Polyurethane adhesives and by the Toughened acrylic adhesives that cure by a free-radical Chain polymerization mechanism. 

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