Electroless deposition process, defined

Electroless deposition can be defined as a deposition of solid phase of continuous coatings (films) or powders of metals, alloys, or compounds from aqueous or nonaqueous solutions or melts without an external current source. Based on this definition, electroless deposition is a purely chemical process, which involves oxido-reduction... 

For cyanide-based baths, the electrolyte pH is the most important process parameter and its value broadly defines other characteristics of the plating bath and actually designates the field of applications of a class of processes. The nature of the deposition mechanism, i.e., electroplating or electroless deposition, is important not only for obvious fundamental reasons but also in relation to the final application. The most important classification key is eventually the type of deposit, as this is directly... 

In this section, the process of electrodeposition is reviewed briefly, and its place in the general context of electrode reactions and charge transfer across the metal/solution interface is set (Section 1.1). In Section 1.2, special emphasis is given to deposition of alloys, and particularly to anomalous deposition of alloys (Sections 1.2.3 and 1.2.4). Next, the phenomenon of induced codeposition is defined, and possible mechanisms are discussed briefly (Section 1.2.5). Several electroless (Section 1.2.6) and electrodeposition processes, in which induced codeposition plays a role, are mentioned. A more extensive discussion of electrodeposition of W-, Mo- and Re-based alloys is included in Section 2. Typical... 

This is essentially a hybrid method in which copper is first deposited onto the whole of either one or two sides of an unclad substrate using the additive process. The wiring pattern is defined in the conventional manner using photoresist and copper is electroplated to build up the thickness of the wiring pattern. Photoresist is stripped and the background electroless copper is removed by a quick etch. 

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