Electrode materials adhesion metal

Unexpected elements in a plasma polymer often are due to the redeposition of ablated materials. The presence of nitrogen found in a plasma polymer of a monomer that does not contain nitrogen can be traced to contamination of the reactor, which has been used for plasma polymerization of nitrogen-containing monomers [1]. The ablation of electrode material has been utilized to create a graded metal-polymer and polymer-metal interfaces to obtain an excellent adhesion [2,3]. Ablation, therefore, could be utilized in a beneficial way in the engineering of interfaces if we know the nature of ablation and how to control it. 

In certain applications of plasma polymerization, the incorporation of electrode material, particularly in a controlled and designed manner, is extremely useful and becomes a great asset in LCVD. For instance, a thin layer of plasma polymer of methane with a tailored gradient of copper has been shown to improve the adhesion of the thin layer to a copper substrate as well as the adhesion of metal to a polymer film [3,4]. In general applications of LCVD, in which the metal contamination should be avoided, it is important to select the electrode material that has low sputtering yield. Titanium has been used successfully in such cases. 

Metal ion modified polyimide films have been prepared to obtain materials having mechanical, electrical, optical, adhesive, and surface chemical properties different from nonmodified polyimide films. For example, the tensile modulus of metal ion modified polyimide films was increased (both at room temperature and 200 0 whereas elongation was reduced compared with the nonmodif ied polyimide (i). Although certain polyimides are )cnown to be excellent adhesives 2) lap shear strength (between titanium adherends) at elevated temperature (275 0 was increased by incorporation of tris(acetylacetonato)aluminum(III) (2). Highly conductive, reflective polyimide films containing a palladium metal surface were prepared and characterized ( ). The thermal stability of these films was reduced about 200 C, but they were useful as novel metal-filled electrodes ( ). 

Polycrystalline oxide materials, both undoped and doped, have been extensively examined for use as photoanodes. Ti02 electrodes have been prepared by thermal oxidation of a Ti plate in an electric furnace in air at 300-800°C (15-60 min) and in a flame at 1300°C (20 min) [27-30]. XRD analysis of thermally oxidized samples indicates the formation of metallic sub-oxide interstitial compounds, i.e. TiOo+x (x < 0.33) or Ti20i y (0 < y < 0.33) and Ti30 together with rutile Ti02 [27]. The characteristic reflection of metallic titanium decreases in intensity after prolonged oxidation (60 min) at 800° C indicating the presence of a fairly thick oxide layer (10-15 pm). Oxidation at 900°C leads to poor adhesion of the oxide film... 

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