Electrochemical Fabrication of Nanocompositions with HTSC Units

8 Prospects for the Electrochemical Fabrication of Nanocompositions with HTSC Units 

The direction of modem device fabrication, is toward production of complex structures (including those with the elements of HTSC) with characteristic dimensions in the micro and nano ranges [426-428]. These include superlattices [429,430], and other nanocompositions [431,432], particularly those which contain HTSC/HTSC junctions (two HTSC materials with different properties), as well as HTSC/metal, HTSC/semiconductor, and HTSC/dielectric junctions. These structures form the basis of modem electronics, and exhibit different size-dependent quantum effects. 

The electrochemical design of special nanocompositions can be achieved both by creating the multilayer structures and by locally modifying the surfaces. These common approaches are used for both the HTSC and or their precursors. 

The more traditional approach has already been used in anodic electrocrystallization processes to produce nanocompositions and superlattices of mixed Ti-Pb oxides [341-347]. With HTSC materials, initial steps have been made in this direction in studies on the electrochemical deposition of conductive polymers on the surface of microband YBCO electrodes [28,50,433]. In the resulting composition, the reversible transition from the HTSC/metal junction (at the high doping degree of the polymer) to the HTSC/semiconductor junction has been achieved. The properties of these compositions allow one to control the shift over a wide interval. 

Compositions of HTSC and ultrathin layers of dyes also exhibit interesting properties [434]. The potentiality of electrosynthesis for fabrication of such structures with specific optical transitions is excellent, particularly as a result of experience gained in studies and applications of the electrochromism phenomenon [435] such as forming films of poorly soluble cyanide complexes [436-441]. These compounds provide the opportunity to carry out electrochemical fabrication of linked and sandwich structures. The region of potential during deposition corresponds to the stability regions of HTSC surfaces. 

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