Elastic encapsulation

It appears that there are several mechanisms for interface distortion. One is distortion caused by viscosity differences (viscous encapsulation), another is caused by normal stress differences in the fluid (elastic encapsulation), and a third is caused by normal velocity differences within the fluid (geometrical encapsulation). Obviously, the distortion will increase when viscosity differences are large and when normal stress differences play a significant role. 

A number of refinements and applications are in the literature. Corrections may be made for discreteness of charge [36] or the excluded volume of the hydrated ions [19, 37]. The effects of surface roughness on the electrical double layer have been treated by several groups [38-41] by means of perturbative expansions and numerical analysis. Several geometries have been treated, including two eccentric spheres such as found in encapsulated proteins or drugs [42], and biconcave disks with elastic membranes to model red blood cells [43]. The double-layer repulsion between two spheres has been a topic of much attention due to its importance in colloidal stability. A new numeri-... 

The component with the lower viscosity tends to encapsulate the more viscous (or more elastic) component (207) during mixing, because this reduces the rate of energy dissipation. Thus the viscosities may be used to offset the effect of the proportions of the components to control which phase is continuous (2,209). Frequently, there is an intermediate situation where a cocontinuous or interpenetrating network of phases can be generated by careflil control of composition, microrheology, and processing conditions. Rubbery thermoplastic blends have been produced by this route (212). 

As previously discussed, many, if not most, cases of particles adhering to substrates involve at least one of the contacting materials deforming plastically, rather than elastically. Under such circumstances, it would be expected that the extent of the contact should increase with time and, with it, the force needed to detach a particle from a substrate. Moreover, material flow can occur, resulting in the engulfment or encapsulation of the particles. 

The acoustic microscopy s primary application to date has been for failure analysis in the multibillion-dollar microelectronics industry. The technique is especially sensitive to variations in the elastic properties of semiconductor materials, such as air gaps. SAM enables nondestructive internal inspection of plastic integrated-circuit (IC) packages, and, more recently, it has provided a tool for characterizing packaging processes such as die attachment and encapsulation. Even as ICs continue to shrink, their die size becomes larger because of added functionality in fact, devices measuring as much as 1 cm across are now common. And as die sizes increase, cracks and delaminations become more likely at the various interfaces. 

The protection of electronic devices has been a key application for specialty silicones, and this application continues to keep pace with the rate of device development (5). Silicones are used in various ways, ranging from resinous circuit board coatings to encapsulants, with the silicone gels representing a unique solution to a diflScult problem, stress relief These dielectric gels are prepared by hydrosilation and are lightly cross-linked poly(dimethylsiloxane)s. Their modulus is extremely low, but they are elastic in their behavior. They have the stress-relief characteristic of a liquid but the nonflow property of an elastomer. These jellylike materials maintain their physical profile over the broad temperature range of-80 to 200 °C. 

ELASTIC AND VISCOELASTIC FRACTURE ANALYSIS OF CRACKS IN POLYMER ENCAPSULATIONS... 

Elastic and Viscoelastic Fracture Analysis of Cracks in Polymer Encapsulations... 

On the contrary, they argue that the specifically elastic properties of thetransfersomes are thecrucial features that allow the lipid vesicle to carry the encapsulated agent across the skin. ... 

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