Dual technology devices

Dual technology devices Incorporate two different types of sensor technology (such as PIR and microwave technology) together in one housing. When both technologies sense an intrusion, an alarm is triggered. 

After the introduction of multislice CT in 1992 with the advent of dual-slice scanners, this technology was improved in 1998 by the implementation of 4-slice, in 2000 with 8-slice, in 2002 with 16-slice, and in 2004 with 64-slice scanners. Development continues and at the turn of 2006 the first 64-slice dual-source devices with a very high temporal and spatial resolution were installed thus one seems to observe a 2-year cycle for the launch of new CT... 

A second commercially available electrolyzer technology is the solid polymer electrolyte membrane (PEM). PEM electrolysis (PEME) is also referred to as solid polymer electrolyte (SPE) or polymer electrolyte membrane (also, PEM), but all represent a system that incorporates a solid proton-conducting membrane which is not electrically conductive. The membrane serves a dual purpose, as the gas separation device and ion (proton) conductor. High-purity deionized (DI) water is required in PEM-based electrolysis, and PEM electrolyzer manufacturer regularly recommend a minimum of 1 MQ-cm resistive water to extend stack life. 

Our technologically advanced way of life would not be possible without the semiconductor industry. The first semiconductor device known as a transistor was discovered at Bell Labs in the late 1940s, and was widely used shortly thereafter for radio electronics. Today, transistors are still pervasive in every microelectronic component such as CD/DVD players, cellular phones, modes of transportation (e.g., planes, automobiles, etc.), and computers. In fact, the dual-core chips released by Intel in early 2006 feature over 1.7 billion transistors - all on a surface that is smaller than a postage stamp ... 

Yuzhakov et al. [93] describe the production of an intracutaneous microneedle array and provide an account of its use (microfabrication technology). Various embodiments of this invention can include a microneedle array as part of a closed loop system smart patch to control drug delivery based on feedback information from analysis of body fluids. Dual purpose hollow microneedle systems for transdermal delivery and extraction which can be coupled with electrotransport methods are also described by Trautman et al. [91] and Allen et al. [100]. These mechanical microdevices which interface with electronics in order to achieve a programmed or controlled drug release are referred to as microelectromechanical systems (MEMS) devices. 

Over 95% of all the microcircuits made are packaged in plastic, usually a transfer moulded epoxy resin. Changes in packaging technology will occur away from the familiar PDIP (plastic dual-in-line package) to smaller SOT or chip carrier formats but plastics will continue to be the dominant packaging material for cost reasons. At the same time there is a need to improve the reliability of plastic encapsulated devices (PEDs) as they find further use in professional and certain military applications. 

Principal solar water-sphtting models had predicted similar dual band gap photoelectrolysis efficiencies of only 16% and 10-18% [3, 28], respectively, whereas recently dual band gap systems were calculated to be capable of attaining over 30% solar photoelectrolysis conversion efficiency [14]. The physics of the earlier models were superb, but their analysis was influenced by dated technology, and underestimated the experimental jjphoto attained by contemporary devices or underestimated the high experimental values of JJelectrolysis which Can be... 

DIP technology uses moisture-resistant plastic compounds to encapsulate MEMSAC devices [2]. As shown in Fig. la (courtesy of Shinko Electric Industries Co. Ltd.), the two rows of pins commonly seen in IC devices that extended out from the plastic body are used for electronic coimections, hence the term dual in-line. 

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