Dispersoids requirements

In the present work, properties of two developmental Al-Zn-Mg-Cu wrought alloys that have about 7% Zn are reported. The alloy compositions were based on the composition of a 7XXX commercial alloy however, the alloys were additionally alloyed with Zr, Sc, and some other dispersoid-forming elements. The required combination of high strength and high ductility was achieved by proper selection of the alloy composition and modification of the processing parameters. 

To detach the dislocation from the dispersoid, a high stress is required. 

Two methods are used to prepare the colloid solution the dispersion method and the condensation method. In the dispersion method, the dispersoid and dispersant are ground repeatedly by a colloid grinder until they meet the required degree of dispersion. The condensation method includes two options. One is the chemical reaction option through hydrolysis or metathesis, and the other is the change solvent option. 

Incorporation of an inorganic secondary component into the matrix of conducting polymers is a useful approach to improve the functionality of conducting polymer-based nanocomposites. Nanoparticles of metal or metal oxide and other nanostructures such as graphene, carbon nanotubes (CNT) are used as dispersoid within conducting polymer matrix depending on the requirements. The shape, size, aspect ratio and the interfacial adhesion between the matrix and dispersoid affect the properties of the hybrid nanocomposites [28]. The synthesis, properties, and applications of different conducting polymer-based hybrid nanocomposites are discussed below. 

Incorporation of dispersoids has been pursued to improve the mechanical and, particularly, thermomechanical behavior of solders and their service-temjjerature capability without significantly altering the processing parameters [16-19]. This chapter addresses the role of dispersoids, their requirements, methods to incorporate them in a solder, and their influence on the microstructure and properties. Prior studies have dealt with several aspects of dispersoids in leadbearing solders, which will be briefly reviewed as they provide the basis for developments in lead-free solder systems. 

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