Socket DieMate

Figure 12.1 shows photographs of the Texas Instruments DieMate Known Good Die socket used for the final microreactor packaging scheme. The particular DieMate socket chosen for the microreactor scale-up system was the 110-pin version (Texas Instruments, Dallas, TX, P/N GBGllO 004 K) since this could accommodate the required sensors. 

As shown in Fig. 12.1(a), the DieMate socket holds the reactor die in place and makes electrical contact through a row of pins on each side of the socket. The pins are forced into contact with the die by four springs that are placed on each comer of the socket. These springs are visible in the side view shown in Fig. 12.1(b). The springs force the upper piece of the socket away from the lower socket body. This force is redirected by the pins to press on the die in the socket. The latching force... 

The DieMate manifold is insulated to improve thermal uniformity and to prevent exposure of the DieMate socket to excess temperature. (The DieMate socket maximum temperature specihcation is 150 °C.) Figure 12.4 shows the insulated DieMate manifold before attachment of the 1 /16-inch transfer lines. The insulation consists of a ceramic hber strip that has a maximum operating temperature of 2300 °F (1260° C). 

Previous microreactor packing schemes developed at both MIT and DuPont could not be used since the electrical and fluidic interfaces required significant effort to implement. The microreactor packaging problem was eventually solved by using the DieMate Known Good Die (KGD) socket manufactured by Texas Instruments (Texas Instruments Incorporated, 34 Forest Street, P.O. Box 2964, Attleboro, MA). 

Fig. 12.1 Texas Instruments DieMate Known Good Die socket used for microreactor packaging in the scale-up system.

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