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Diamond films, adherent

A procedure for Ni(OH)2 deposition on diamond was developed [144], with the intent of exploiting the structure in a battery. The Ni(OH)2 film adhered well to the diamond substrate and retained its capacity even after 4000 charging/discharging cycles. [Pg.251]

Its unique combination of excellent physical and chemical properties make diamond one of the most technologically advanced materials available today. Most uses of diamond require depositing a highly adherent thin diamond film onto a non-diamond substrate. [Pg.152]

When techniques for producing smooth, adherant diamond films are developed, it is expected that they will have extensive application in the semiconductor packaging industry because of diamond s high thermal conductivity (about five times that of copper) and high electrical resistivity. Diamond can also be used as a cold cathode electron emitter and, as such, is of interest in the flat panel display industry. Diamond films may also provide protection to surfaces in low Earth orbit where oxygen erosion is a problem. [Pg.387]

For water electrolysis, the self-standing perforated diamond electrode was used as the anode, being set as shown in Fig. 24.1 (a). Platinum mesh (55 mesh, Nilaco Co., Japan) was used as the cathode. Nafion films (DuPont, USA) were used as the solid-state polymer electrolyte membrane to separate the anode and cathode compartments, to which the anode and cathode adhered firmly and uniformly. Ultrapure water (purified by a Milli-Q system, Millipore Japan, Ltd.) was continuously supplied into each compartment at a flow rate of 0.1 L min. The electrolysis was performed by the constant current method. The ozone concentration was checked with an ozone meter (03 2Z, Kasahara Chemical Instruments Co., Japan). [Pg.550]


See other pages where Diamond films, adherent is mentioned: [Pg.219]    [Pg.85]    [Pg.84]    [Pg.106]    [Pg.85]    [Pg.219]    [Pg.81]    [Pg.345]    [Pg.351]    [Pg.361]    [Pg.409]    [Pg.136]    [Pg.611]    [Pg.244]    [Pg.220]    [Pg.168]    [Pg.399]    [Pg.399]    [Pg.213]    [Pg.881]    [Pg.427]    [Pg.609]    [Pg.212]    [Pg.254]    [Pg.2497]    [Pg.997]    [Pg.452]    [Pg.580]    [Pg.234]   
See also in sourсe #XX -- [ Pg.611 ]




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