DGEBA-type epoxies, mixing with

As with amidoamine and polyamide cured adhesives, epoxy resins cured with aliphatic amines exhibit tensile shear strength that is dependent on the type of filler and concentration. Table 11.10 shows the effect of filler loading on strength of a simple general-purpose, room temperature curing epoxy adhesive composed of liquid DGEBA epoxy mixed with 10 pph of a tertiary amine. 

Curatives have been prepared via condensation of (meth)acrylonitrile with various hydrazides such as carbohydrazide, oxalyl dihydrazide, and succinyl dihydrazide (Eq. 16). When these cyanoethylated and cyanopropylated hydrazides are mixed with DGEBA-type resins, viscosity increases are noted in 4-5 days at room temperature. However, these partially reacted mixtures are still uncrosslinked and flowable at temperatures near their final cure temperature of around 120°C. At this temperature reaction occurs very rapidly for a variety of epoxide-to-amine ratios. Adhesive compositions of DGEBA-type epoxy resins and the cyanoalkylated hydrazides give extremely strong bonds on substrates such as sheet moulding compound (SMC) and steel. 

Mixing of DGEBA-type epoxies with multifunctional amines [e.g., 4,4 -diaminodiphenyl-methane (DDM), ethylene diamine (EDA), 4,4 -methylenebis 2,6-diethylaniline (MDEA), 4,4 -methylenebis(3-chloro-2,6-... 

Commercial cement modifiers used were based on a bisphenol A-type epoxy resin, diglycidyl ether of bisphenol A (DGEBA), which was mixed with three types of hardeners, modified polyamide-amine (MPAA),modified aliphatic polyamine (MAPA).and modified amine (MA) at the hardener contents recommended by the respective manufacturers. The hardener content was expressed as follows ... 

In adhesive formulations, aliphatic amines are most commonly used to cure the DGEBA type of epoxy resin. Aliphatic amines are not widely used with the non-glycidyl ether resins, since the amine-epoxy reaction is slow at low temperatures. The reaction usually requires heat and accelerators for an acceptable rate of cure. Aliphatic amines are primarily used with lower-viscosity DGEBA resins because of the difficulty in mixing such low-viscosity curing agents with the more viscous epoxy resins. 

Some of the first commercial conductive epoxy adhesives were simply based on silver powder dispersed in a liquid epoxy resin [e.g., diglycidyl ether of bisphenol A (DGEBA)] with an aliphatic amine [e.g., triethylene tetramine (TETA)] as a curing agent. Although capable of room-temperature cure, commercialization of this type of system was hampered by severe mix ratio disparity (typically, 50 1 by weight), problematic mixing due to viscosity differences, short pot life, and safety concerns. See Table 3 for typical properties of this type of formulation. 

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