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Device fabrication anode preparation

A num ber of different techniques have been used to study the surface preparation techniques used prior to anodic oxidation. For device fabrication, mechanical polishing Is usually necessary to insure a relatively flat surface. Some chemical treatment is necessary to remove the mechanical damage induced by grit polishing. Often etching or chem-mechanical polishing is used to remove this damaged layer. However, it has been shown that chemical treatments do not leave a stoichiometric surface (27-30)(63). A kinetic study of the reaction of 0.1N Br in methanol with (Hg,Cd)Te under etch conditions found the relative rates of reaction of the individual constituents to be ... [Pg.149]

In Chapter 10, the authors will demonstrate the preparation techniques for ASPEM and the characterization results. The relationship between structure and properties will be discussed and compared. The double-layer carbon air cathodes were also prepared for solid-state alkaline metal fuel cell fabrication. The alkaline solid state electrochemical systems, sueh as Ni-MH, Zn-air fuel cells, Al-air fuel cells, Zn-Mn02 and Al-Mn02 cells, were assembled with anodes, cathodes and alkaline solid polymer electrolyte membranes. The electrochemical cells showed excellent cell power density and high electrode utilization. Therefore, these PVA-based solid polymer electrolyte membranes have great advantages in the applications for all-solid-state alkaline fuel cells. Some other potential applieations include small electrochemical devices, sueh as supercapacitors and 3C electronic products. [Pg.499]

A p-n-heterojunction type device can be fabricated on the basis of the junction formed between poly(pyrrole) and PT derivatives (e.g. PT or PMT) [784]. A PODT/Cfio junction device with a photo-induced charge transfer between PODT and Cgo is shown in Fig. 22 [449]. Rectifying bilayer electrodes with sequential bilayer structures are prepared from any pair of PBT/poly(pyrrole) and poly(3-bromothiophene)/poIy(pyrrole) by anodic electropolymerization on platinum electrodes [785]. [Pg.120]


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Device Preparation

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