Finite element modeling design for reliability

Design for Reliability—Finite Element Modeling of Lead-Free Solder Interconnects... 

With increased understanding of various types of SMPs, physics based constitutive modeling is possible. With such models, fewer parameters will be needed and the predictability of the models will be more reliable and accurate. Also, a physics based model can be easily integrated into finite element modeling (FEM) so that SMP based engineering structures and devices can be analyzed and designed. This will be a direction for future studies. 

This chapter has focused on the numerical tools used in the design for reliability of lead-free solder joints. These tools include the finite element method, in general, and, in particular, the use of 3D strip models, specific material properties, and the use of a creep strain energy... 

Once the constitutive relationship and fatigue life models for lead-free solders have been established, the design for reliability methodologies through multi-scale finite element analysis (FEA) can be applied to lead-free solder interconnects. 

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