Curing reaction/agent

Kinetics and mechanism of curing reactions using ylides as a new curing agent. 

The organofunctional group (R) in the coupling agent causes the reaction with the polymer. This could be a copolymerization and/or the formation of an interpenetrating network. This curing reaction of a silane-treated substrate enhances the wetting by the resin (Table 9). 

Aromatic amines formed from the reduction of azo colorants in toy products were analysed by means of HPLC-PDA [703], Drews et al. [704] have applied HPLC/ELSD and UV/VIS detection for quantifying SFE and ASE extracts of butyl stearate finish on various commercial yarns. From the calibrated ELSD response the total extract (finish and polyester trimer) is obtained and from the UV/VIS response the trimer only. Representative SFE-ELSD/UV finish analysis data compare satisfactorily to their corresponding SFE gravimetric weight recovery results. GC, HPLC and SEC are also used for characterisation of low-MW compounds (e.g. curing agents, plasticisers, by-products of curing reactions) in epoxy resin adhesives. 

The DGEBA based epoxies were reacted with various curing agents. These spectra were than compared to the solution spectra of unreacted epoxy. It was shown that the peaks due to the epoxide carbons were not present in the polymerized DGEBA. In their previous study, Sojka and Moniz 481 showed that DGEBA partially cured with piperidine, exhibited a peak near the methylene peak that increased in intensity and complexity with the curing reaction. This peak was assigned to the carboxyl-methine ether carbon and the methylene carbon near the reaction site. These studies addressed the questions ... 

In Chapter 2 the DSC technique is discussed in terms of instruments, experimental methods, and ways of analysing the kinetic data. Chapter 3 provides a brief summary of epoxy resin curing reactions. Results of studies on the application of DSC to the cure of epoxy resins are reviewed and discussed in Chapter 4. These results are concerned with the use of carboxylic acid anhydrides, primary and secondary amines, dicyanodiamide, and imidazoles as curing agents. 

Curing reactions Vulcanisation reactions Isothermal ageing Product stability Thermal degradation Identification of processing aids Plasticisers Mould lubricants Blowing agents Antioxidants Flame retardants Safety concerns... 

As epoxy resins can vary enormously as suggested above, so can the means for curing these resins. Curing reactions specific to specific types of curing agents or catalysts are described in Chap. 5. 

Polysulfide resin, on the other hand, does not have fast and low-temperature curing properties. It is used as more of a flexibilizer than a curing agent. However, polysulfide resins do have mercaptan groups, and these enter into the epoxy cure reaction. 

As observable from the SFM topography measurements, the surface of the epoxy inside the holes of the copper film exhibits a slight convex curvature, probably due to the surface tension of the epoxy formulation. Hence, the epoxy surface nearby the Cu/epoxy interface was not in contact with the mica substrate when curing the mixture of epoxy resin and curing agent, and any interference on the curing reaction from the presence of the mica can be ruled out. On the other hand, the local slope of the curved epoxy surface is... 

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