Cupric formate

Cu(CH02)2 (c). Berthelot9-10 measured the heat of solution of cupric formate. 

Cu(CH02)2 4 NH3 (c). Ephraim and Bolle2 measured the dissociation pressures of the tetrammine of cupric formate. 

Nakamura, H., Tsuchida, R. (1957) Spectrochemical study of microscopic crystals. XVI. Spectra of cupric formate, acetate and propionate. Bull. Chem. Soc. Japan 30, 953. 

Copper diformate Copper formate Cupric diformate Cupric formate EINECS 208-865-8 Formic acid, copper(2 ) salt (1 1) Formic acid copper(2-i-) salt HSDB 260 NSC 112232 Tubercuprose Cufor. Antibacterial agent used to treat cellulose. Light blue, royal blue or turquoise crystals soluble In H2O, insoluble in organic solvents. Mechema Chemicals Ltd. 

Phys. Solid State Phys. Symp. 11th Kanpur, India 1%7, Solid State Phys., 127. C.A.70 (1969) 15885m. Reddy, T.R., and R. Srinivasan ESR Study of the Cu Ion in Dibarium Cupric Formate. Proc. Nucl. Phys. Solid State Phys. Symp. 11th Kanpur, India 1%7, Solid Slate Phys., 110. C.A.70 (1969) 15899u. 

Aqueous ammonia also acts as a base precipitating metallic hydroxides from solutions of their salts, and in forming complex ions in the presence of excess ammonia. For example, using copper sulfate solution, cupric hydroxide, which is at first precipitated, redissolves in excess ammonia because of the formation of the complex tetramminecopper(TT) ion. 

Copper Corrosion Inhibitors. The most effective corrosion inhibitors for copper and its alloys are the aromatic triazoles, such as benzotriazole (BZT) and tolyltriazole (TTA). These compounds bond direcdy with cuprous oxide (CU2O) at the metal surface, forming a "chemisorbed" film. The plane of the triazole Hes parallel to the metal surface, thus each molecule covers a relatively large surface area. The exact mechanism of inhibition is unknown. Various studies indicate anodic inhibition, cathodic inhibition, or a combination of the two. Other studies indicate the formation of an insulating layer between the water surface and the metal surface. A recent study supports the idea of an electronic stabilization mechanism. The protective cuprous oxide layer is prevented from oxidizing to the nonprotective cupric oxide. This is an anodic mechanism. However, the triazole film exhibits some cathodic properties as well. 

In the initial formation of the cupric xanthates, soluble xanthate complexes form prior to the precipitation of the cuprous xanthate with the concurrent formation of the dixanthogen (51). The dixanthogen can be separated by virtue of its solubiUty in ether. Older samples of alkah metal xanthates contain some dixanthogen, which is thought to form by the following reaction (33) ... 

Cupric ion concentration is kept at an acceptable but low level by direct air oxidation of the solution. SoHds formation from sulfides in the feed gas is also possible therefore, pretreatment for sulfur removal is required. 

Carbon dioxide can cause product contamination through ammonium carbonate formation. Ammonium carbonate may also form by oxidation of carbon monoxide by cupric ion (eq. 27) ... 

The darkening reaction involves the formation of silver metal within the silver haUde particles containing traces of cuprous haUde. With the formation of metallic silver, cuprous ions are oxidized to cupric ions (1,4). The thermal or photochemical (optical bleaching) reversion to the colorless or bleached state corresponds to the reoxidation of silver to silver ion and the reduction of cupric ion to reform cuprous ion. 

Since the sequence includes formation and removal of the dioxolane group, the overall yield is not significantly higher than with the direct cupric bromide halogenation. 

Copper is the first member of Group IB of the periodic table, having atomic number 29 and electronic configuration 2.8.18.1. Loss of the outermost electron gives the cuprous ion Cu, and a second electron may be lost in the formation of the cupric ion Cu. ... 

K has the value of about 1 x 10 at 298 K, and in solutions of copper ions in equilibrium with metallic copper, cupric ions therefore greatly predominate (except in very dilute solutions) over cuprous ions. Cupric ions are therefore normally stable and become unstable only when the cuprous ion concentration is very low. A very low concentration of cuprous ions may be produced, in the presence of a suitable anion, by the formation of either an insoluble cuprous salt or a very stable complex cuprous ion. Cuprous salts can therefore exist in contact with water only if they are very sparingly soluble (e.g. cuprous chloride) or are combined in a complex, e.g. [Cu(CN)2) , Cu(NH3)2l. Cuprous sulphate can be prepared in non-aqueous conditions, but because it is not sparingly soluble in water it is immediately decomposed by water to copper and cupric sulphate. 

As feed systems usually contain copper alloys, the use of amines for their protection may seem somewhat strange as copper is prone to attack in ammonia/carbon dioxide/oxygen environments, with the formation of complex cupric or cuprous compounds. The requisite degree of protection can be achieved, however, by maintaining the concentrations strictly within the acceptable target range. 

Although this reaction may cause slight problems, the primary issue concerning ammonia is ammoniacal corrosion of CR system metals where oxygen is present and the pH is over 8.3. Under these circumstances, copper and its alloys and other nonferrous metals are attacked, and severe damage results due to the formation of a stable cupric ammonium complex ion. 

NOTE Cupric copper (Cu2+) is a catalyst for the hydrazine-oxygen reaction, as well as a catalyst for sulfite, DEHA, erythorbic acid, and hydroquinone. Cuprous copper (Cu+) acts as a complexing agent in the desirable formation of protective, pasivated copper oxide films. 

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