Copper polymer interface

Electrified interfaces are predominantly built up by mobile charged species which in the case of metal/polymer interfaces may be identified with ions embedded in the polymeric matrix. Therefore, electrochemically driven reactions prevail in environments which allow the presence of such species. Furthermore, the conservation of charge may require the presence of ion-transfer reactions and this condition is almost always satisfied for reactive metals such as iron, copper, zinc, and aluminum. 

In the present paper. Static Secondary Ion Mass Spectrometry (SSIMS) is used to investigate the interfacial chemistry between vacuum-deposited Al and Cu on PET by following the initial stages of metallization in the submonolayer and monolayer regimes. From the SIMS intensity variations with the deposited metal flux, information on the initial growth mechanisms of the metal layer Is expected. Two metals, copper and aluminum, have been chosen In order to investigate the influence of the metal reactivity on the metal-polymer interface formation. Aluminum with its electropositive sp band is known to react strongly with the carbonyl functionalities of the whereas copper is an inert metal and its Interaction is believed to be much weaker. ... 

After a brief description of the fundanietitals of High Resolution Electron Energy Loss Spectroscopy (HREELS), its potentialities in elucidating chemical reactions at a metal-polymer interface are illustrated by the well-known case of alunuRium evaporated onto polyimide (PMDA-OOA). Then the diHkuldes (but also the new promises) in roudnely applying this new spectroscopy to any metal-polymer sysKm will be shown for the copper-polyphenylquinoxaline interface. 

INTERFACIAL CATALYSIS plays a very important part in surface (interfacial) degradation. Oxidation can be catalyzed by various metals. Catalysis can start at metal/polymer interfaces and metal ions can diffuse into the polymer. The catalytic action by copper or its oxides, for instance, during oxidative degradation of polyethylene and isotactic polypropylene, respectively, has been studied in detail. Some relevant results will be briefly discussed here. 

Bonding Agents. These materials are generally only used in wire cable coat compounds. They are basically organic complexes of cobalt and cobalt—boron. In wire coat compounds they are used at very low levels of active cobalt to aid in the copper sulfide complex formation that is the primary adherance stmcture. The copper sulfide stmcture builds up at the brass mbber interface through copper in the brass and sulfur from the compound. The dendrites of copper sulfide formed entrap the polymer chains before the compound is vulcanized thus hoi ding the mbber firmly to the wire. 

More recently, Iiu et al. reported that a variety of non-chiral amphiphilic diacetylenes, non-chiral barbituric acids or amphiphilic aryl-benzimidazoles self-assemble into chiral clusters at the air/water interface or on aqueous solutions containing Ag+ ions, as demonstrated by CD measurements [108-111]. The chiral macroscopic conformational morphology of the polymers generated from copper salts of non-chiral monomers was imaged after their transfer onto solid support [ 112,113]. 

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