Copper filler

Theoretically, boron nitride is an optimum filler for thermally conductive adhesives. However, it is difficult to fill systems greater than 40 percent by weight with boron nitride. Beryllium oxide is high in cost, and its thermal conductivity drops drastically when it is mixed with organic resins. Therefore, aluminum, aluminum oxide, and copper fillers are commonly used in thermally conductive adhesive systems. 

Brazing of CoCr-alloys can be performed either in a hydrogen atmosphere or in vacuum. As filler metals Ni- or Co-base alloys or Au-Pd-alloys can be used. In order to achieve a better wetting by the filler metals an electroplating or flashing with Ni is performed. Copper filler metals should be avoided because of the danger of an embrittlement of the seam. Table lb.8 shows the compositions of a typical Co-base filler metal. 

Putson, C., Lebrun, L., Guyomar, D., Muensit, N., Cottinet, P. J., Seveyrat, L., Guiffard, B., 2011. Effects of copper filler sizes on the dielectric properties and the energy harvesting capability of Donpercolated polyurethane composites. Journal of Applied Physics 109, 024104. 

Fig. 4. Submersible oil well pump cable. A, SoHd copper conductor B, EPR-based insulation C, chemical barrier D, lead sheath E, filler E, galvanised...

Nickel—copper alloys also are used as coated electrodes or filler alloys for welding purposes. Coinage is typically an alloy of 75 wt % Cu and 25 wt % Ni. 

For many electronic and electrical appHcations, electrically conductive resias are required. Most polymeric resias exhibit high levels of electrical resistivity. Conductivity can be improved, however, by the judicious use of fillers eg, in epoxy, silver (in either flake or powdered form) is used as a filler. Sometimes other fillers such as copper are also used, but result in reduced efficiency. The popularity of silver is due to the absence of the oxide layer formation, which imparts electrical insulating characteristics. Consequently, metallic fibers such as aluminum are rarely considered for this appHcation. 

Table 5. Chemical Composition Requirements for Copper-Based Filler Metals ...

The metal fillers act as a reinforcing material that results in added strength and stiffness (126). They color the plastic gray for nickel, 2inc, stainless steel, and aluminum, and brown for copper. Metal additives are more expensive than carbon black or surface-active agents, but they get extensive use in EMI shielding appHcations. 

Impurities in mineral fillers can have serious effects. Coarse particles (grit) will lead to points of weakness in soft polymers which will therefore fail under stresses below that which might be expected. Traces of copper, manganese and iron can affect the oxidative stability whilst lead may react with sulphur-containing additives or sulphurous fumes in the atmosphere to give a discoloured product. 

Manganese, copper, iron, cobalt and nickel ions can all initiate oxidation. Untinned copper wire can have a catastrophic effect on natural rubber compounds with which it comes into contact. Inert fillers for use in rubbers are usually tested for traces of such metal ions, particularly copper and manganese. The problem is perhaps less serious in saturated hydrocarbon polymers but still exists. 

Elastomers, plastics, fabrics, wood and metals can be joined with themselves and with each other using nitrile rubber/epoxy resin blends cured with amines and/or acidic agents. Ethylene-propylene vulcanizates can also be joined using blends of carboxylated nitrile rubber, epoxy resin and a reactive metal filler (copper, nickel, cobalt). However, one of the largest areas of use of nitrile rubber modified epoxy systems is in the printed circuit board area [12]. 

Fillers can also be used to promote or enhance the thermal stability of the silicone adhesive. Normal silicone systems can withstand exposure to temperatures of 200 C for long hours without degradation. However, in some applications the silicone must withstand exposure to temperatures of 280 C. This can be achieved by adding thermal stabilizers to the adhesive formulations. These are mainly composed of metal oxides such as iron oxide and cerium oxide, copper organic complexes, or carbon black. The mechanisms by which the thermal stabilization occurs are discussed in terms of radical chemistry. 

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