Copper electrolytic etching

The process consists of pre-etching, etching, etch neutralization, catalyst appHcation, catalyst activation, and plating. Most commercial appHcations, except REl/EMl shielding, use the initial copper or nickel deposit as a base for subsequent electrolytic plating of electrolytic copper, nickel, or chromium. The exact types and thicknesses of metal used are determined by part usage, eg, automotive exterior, decorative, plumbing, and others (24). 

CEER process — (Capenhurst electrolytic etchant regeneration process) Electrochemical process for continuous copper removal from printed circuit board etching solutions employing either cupric chloride or ammoniacal etchant. In a cell divided by a cation exchange membrane the etching process is essentially reversed. In case of the cupric chloride etchant the etchant solution is pumped to the anode, the processes are at the... 

Region I. Minimal etching takes place in this region. Owing to the passivation provided by electrolyte, the copper dissolution is kept at minimal, especially compared to the traditional electropolishing. 

The same investigation showed that copper-precoated ceramic plates coated with aluminum can be etched like copper circuit boards. A comparative study of galvanoaluminum layers and other electrolytically precipitated deposits was recently published [140]. 

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